View source for 18665942. CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)

=CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:KABUSHIKI KAISHA TOSHIBA|KABUSHIKI KAISHA TOSHIBA]]


[[Category:KABUSHIKI KAISHA TOSHIBA]]

==Inventor(s)==

[[:Category:Toshihide Ueno of Yokohama (JP)|Toshihide Ueno of Yokohama (JP)]][[Category:Toshihide Ueno of Yokohama (JP)]]

==CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18665942 titled 'CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The abstract describes a ceramic circuit substrate that consists of a ceramic substrate, a metal circuit, and a metal member. The metal circuit is on one surface of the ceramic substrate, with a thickness of at least 1 mm, while the metal member is on the other surface, also with a thickness of at least 1 mm. The ratio of the total volume of the metal circuit to the total volume of the metal member falls between 0.80 and 1.20.

* The ceramic circuit substrate includes a ceramic substrate, a metal circuit, and a metal member.
* The metal circuit is located on one surface of the ceramic substrate with a thickness of at least 1 mm.
* The metal member is located on the other surface of the ceramic substrate with a thickness of at least 1 mm.
* The ratio of the total volume of the metal circuit to the total volume of the metal member is between 0.80 and 1.20.

Potential Applications:
- Electronic devices
- Circuit boards
- Power distribution systems

Problems Solved:
- Enhanced durability and stability of circuit substrates
- Improved performance of electronic components

Benefits:
- Increased reliability of electronic systems
- Longer lifespan of circuit substrates
- Better heat dissipation capabilities

Commercial Applications:
Title: Advanced Ceramic Circuit Substrates for High-Performance Electronics
This technology can be utilized in the manufacturing of electronic devices, circuit boards, and power distribution systems, enhancing their performance and longevity in various industries such as telecommunications, automotive, and aerospace.

Questions about Ceramic Circuit Substrates:
1. How does the thickness of the metal circuit and metal member impact the overall performance of the ceramic circuit substrate?
The thickness of the metal circuit and metal member plays a crucial role in ensuring the durability and stability of the circuit substrate, as well as in providing efficient heat dissipation for electronic components.

2. What are the key factors to consider when designing ceramic circuit substrates for specific applications?
Design considerations for ceramic circuit substrates include the material properties, circuit layout, and thermal management requirements to meet the performance needs of different electronic systems.


==Original Abstract Submitted==

A ceramic circuit substrate according to an embodiment includes a ceramic substrate, a metal circuit, and a metal member. The metal circuit is located at one surface of the ceramic substrate. The thickness of the metal circuit is not less than 1 mm. The metal member is located at another surface of the ceramic substrate. The thickness of the metal member is not less than 1 mm. A ratio Vf/Vb of a total volume Vf of the metal circuit to a total volume Vb of the metal member is not less than 0.80 and not more than 1.20.



[[Category:H01L23/373]]
[[Category:H01L21/48]]
[[Category:CPC_H01L23/3735]]