View source for 18663314. PATTERNED CONDUCTIVE ARTICLE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)

=PATTERNED CONDUCTIVE ARTICLE=


==Organization Name==

[[:Category:3M INNOVATIVE PROPERTIES COMPANY|3M INNOVATIVE PROPERTIES COMPANY]]


[[Category:3M INNOVATIVE PROPERTIES COMPANY]]

==Inventor(s)==

[[:Category:Raymond P. Johnston of Lake Elmo MN (US)|Raymond P. Johnston of Lake Elmo MN (US)]][[Category:Raymond P. Johnston of Lake Elmo MN (US)]]

[[:Category:Kevin W. Gotrik of Hudson WI (US)|Kevin W. Gotrik of Hudson WI (US)]][[Category:Kevin W. Gotrik of Hudson WI (US)]]

[[:Category:John J. Sullivan of Hudson WI (US)|John J. Sullivan of Hudson WI (US)]][[Category:John J. Sullivan of Hudson WI (US)]]

[[:Category:Kenneth A.P. Meyer of Eagan MN (US)|Kenneth A.P. Meyer of Eagan MN (US)]][[Category:Kenneth A.P. Meyer of Eagan MN (US)]]

[[:Category:Joseph C. Carls of Austin TX (US)|Joseph C. Carls of Austin TX (US)]][[Category:Joseph C. Carls of Austin TX (US)]]

[[:Category:Haiyan Zhang of Lake Elmo MN (US)|Haiyan Zhang of Lake Elmo MN (US)]][[Category:Haiyan Zhang of Lake Elmo MN (US)]]

[[:Category:Gregory L. Abraham of Austin TX (US)|Gregory L. Abraham of Austin TX (US)]][[Category:Gregory L. Abraham of Austin TX (US)]]

[[:Category:Matthew S. Stay of Bloomington MN (US)|Matthew S. Stay of Bloomington MN (US)]][[Category:Matthew S. Stay of Bloomington MN (US)]]

==PATTERNED CONDUCTIVE ARTICLE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18663314 titled 'PATTERNED CONDUCTIVE ARTICLE

The abstract of this patent application describes a patterned conductive article that includes a substrate with a groove, a conductive seed layer in the groove, and a unitary conductive body in the groove.

* The conductive seed layer covers the bottom surface of the groove, while the unitary conductive body covers the seed layer and the side surfaces of the groove.
* The unitary conductive body has lower line edge roughness at the interface with the side surfaces compared to the seed layer.
* The innovation involves the precise deposition and coverage of the conductive materials within the groove to enhance conductivity and structural integrity.

Potential Applications:
* This technology can be used in electronic devices, sensors, and other applications requiring precise and reliable conductive patterns.

Problems Solved:
* Provides a solution for improving conductivity and structural integrity in patterned conductive articles.

Benefits:
* Enhanced conductivity and structural integrity.
* Precise deposition of conductive materials.

Commercial Applications:
* This technology can be applied in the manufacturing of electronic devices, sensors, and other high-tech products.

Questions about the technology:
1. How does the lower line edge roughness of the unitary conductive body improve the performance of the conductive article?
2. What are the potential cost-saving implications of using this technology in manufacturing processes?


==Original Abstract Submitted==

A patterned conductive article includes a substrate having a first groove therein; a conductive seed layer disposed in the first groove; and a unitary conductive body disposed at least partially in the first groove. The conductive seed layer covers at least a majority of a bottom surface of the first groove, and the unitary conductive body covers the conductive seed layer and at least a majority of side surfaces of the first groove. In a plane through the unitary conductive body that is parallel to and separate from the conductive seed layer, the unitary conductive body has a lower first line edge roughness at a first interface with the side surfaces and the conductive seed layer has a higher second line edge roughness at an edge of the conductive seed layer.



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