View source for 18651815. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)

=SEMICONDUCTOR MODULE=


==Organization Name==

[[:Category:ROHM CO., LTD.|ROHM CO., LTD.]]


[[Category:ROHM CO., LTD.]]

==Inventor(s)==

[[:Category:Yuki Nakano of Kyoto-shi (JP)|Yuki Nakano of Kyoto-shi (JP)]][[Category:Yuki Nakano of Kyoto-shi (JP)]]

==SEMICONDUCTOR MODULE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18651815 titled 'SEMICONDUCTOR MODULE

The semiconductor module described in the patent application consists of a housing with a semiconductor device inside, a chip with a main surface, a main surface electrode, a terminal electrode, a sealing insulator, and an insulating gel-like filling agent.

* The semiconductor device is sealed in the housing space with the insulating gel-like filling agent.
* The chip of the semiconductor device has a main surface electrode and a terminal electrode.
* The sealing insulator covers the periphery of the terminal electrode on the main surface, leaving a part of the terminal electrode exposed.
* The insulating gel-like filling agent fills the housing space and contacts the sealing insulator to seal the semiconductor device securely.

Potential Applications:
- This technology can be used in various electronic devices requiring reliable and secure sealing of semiconductor devices.
- It can be applied in automotive electronics, consumer electronics, industrial equipment, and more.

Problems Solved:
- Provides a secure and reliable sealing solution for semiconductor devices in electronic applications.
- Ensures protection of the semiconductor device from external elements and environmental factors.

Benefits:
- Enhanced protection and longevity of semiconductor devices.
- Improved reliability and performance of electronic devices.
- Cost-effective solution for sealing semiconductor devices.

Commercial Applications:
- This technology can be utilized by semiconductor manufacturers, electronic device manufacturers, and other industries requiring secure semiconductor device sealing solutions.

Questions about Semiconductor Module Sealing Technology:

1. How does the insulating gel-like filling agent contribute to the sealing of the semiconductor device?
   - The insulating gel-like filling agent fills the housing space and contacts the sealing insulator to provide a secure seal for the semiconductor device.

2. What are the potential applications of this semiconductor module technology?
   - This technology can be applied in various electronic devices across different industries for secure sealing of semiconductor devices.


==Original Abstract Submitted==

A semiconductor module includes a housing that has a housing space, a semiconductor device that is arranged in the housing space, and that has a chip having a main surface, a main surface electrode arranged on the main surface, a terminal electrode arranged on the main surface electrode, and a sealing insulator covering a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and an insulating gel-like filling agent that is filled in the housing space such as to contact the sealing insulator, and that seals the semiconductor device in the housing space.



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