View source for 18650982. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:In-Wook Oh of Suwon-si (KR)|In-Wook Oh of Suwon-si (KR)]][[Category:In-Wook Oh of Suwon-si (KR)]]

[[:Category:Byungyun Kang of Anyang-si (KR)|Byungyun Kang of Anyang-si (KR)]][[Category:Byungyun Kang of Anyang-si (KR)]]

[[:Category:Donghyun Kim of Hwaseong-si (KR)|Donghyun Kim of Hwaseong-si (KR)]][[Category:Donghyun Kim of Hwaseong-si (KR)]]

[[:Category:Hyungjune Kim of Suwon-si (KR)|Hyungjune Kim of Suwon-si (KR)]][[Category:Hyungjune Kim of Suwon-si (KR)]]

[[:Category:Jaebong Jung of Suwon-si (KR)|Jaebong Jung of Suwon-si (KR)]][[Category:Jaebong Jung of Suwon-si (KR)]]

==SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18650982 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the patent application includes a substrate with a cell region and a dummy region, a first metal layer with a dummy line on the dummy region, a power delivery network on the bottom surface of the substrate, and a first through via that penetrates the substrate and connects to the dummy line.

* The device features a power delivery network with lower lines and a pad line below them, all electrically connected to the first through via.
* The first through via extends from the power delivery network towards the dummy line, ensuring efficient power distribution.
* The dummy region and dummy line help optimize the layout and functionality of the semiconductor device.
* By integrating the power delivery network and the dummy line, the device enhances overall performance and reliability.
* The design of the device allows for effective power management and distribution within the semiconductor structure.

Potential Applications:
- This technology can be applied in various semiconductor devices requiring efficient power delivery systems.
- It can be utilized in the manufacturing of integrated circuits, microprocessors, and other electronic components.

Problems Solved:
- Efficient power distribution within the semiconductor device.
- Optimization of layout and functionality for improved performance.
- Enhanced reliability and power management capabilities.

Benefits:
- Improved power efficiency and distribution.
- Enhanced performance and reliability of semiconductor devices.
- Optimal layout design for better functionality.

Commercial Applications:
Title: Advanced Semiconductor Device for Efficient Power Delivery
This technology can be utilized in the production of high-performance electronic devices, leading to improved efficiency and reliability in various industries such as telecommunications, computing, and consumer electronics.

Prior Art:
Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of semiconductor device design, power delivery networks, and integrated circuit layouts.

Frequently Updated Research:
Researchers and developers in the semiconductor industry are constantly exploring new methods and technologies to enhance power delivery efficiency and optimize semiconductor device performance. Stay updated on the latest advancements in this field to leverage cutting-edge innovations for future projects.

Questions about Semiconductor Device with Efficient Power Delivery:
1. How does the integration of the power delivery network and dummy line improve the performance of the semiconductor device?
2. What are the potential applications of this technology in different industries?


==Original Abstract Submitted==

Disclosed is a semiconductor device comprising a substrate that includes a cell region and a dummy region, a first metal layer on the substrate and including a dummy line on the dummy region, a power delivery network on a bottom surface of the substrate, and a first through via that penetrates the substrate and extends from the power delivery network toward the dummy line. The first through via is electrically connected to the dummy line. The power delivery network includes a plurality of lower lines and a pad line below the lower lines. The pad line is electrically connected through the lower lines to the first through via.



[[Category:H01L27/02]]
[[Category:H01L21/8238]]
[[Category:H01L23/48]]
[[Category:H01L23/528]]
[[Category:H01L27/092]]
[[Category:H01L29/06]]
[[Category:H01L29/08]]
[[Category:H01L29/423]]
[[Category:H01L29/78]]
[[Category:H01L29/786]]
[[Category:CPC_H01L27/0207]]