View source for 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=Heterogeneous Antenna in Fan-Out Package=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Po-Yao Chuang of Hsinchu (TW)|Po-Yao Chuang of Hsinchu (TW)]][[Category:Po-Yao Chuang of Hsinchu (TW)]]

[[:Category:Po-Hao Tsai of Taoyuan City (TW)|Po-Hao Tsai of Taoyuan City (TW)]][[Category:Po-Hao Tsai of Taoyuan City (TW)]]

[[:Category:Shin-Puu Jeng of Hsinchu (TW)|Shin-Puu Jeng of Hsinchu (TW)]][[Category:Shin-Puu Jeng of Hsinchu (TW)]]

==Heterogeneous Antenna in Fan-Out Package - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18647106 titled 'Heterogeneous Antenna in Fan-Out Package

The method described in the patent application involves bonding an antenna substrate to a redistribution structure, encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure.

* The antenna substrate contains a first part of a first antenna, while the redistribution structure contains a second part of the first antenna.
* The redistribution structure also includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.

Potential Applications:
- This technology could be used in the development of advanced wireless communication devices.
- It may find applications in the manufacturing of compact and efficient antenna systems for IoT devices.

Problems Solved:
- The method addresses the challenge of integrating multiple antenna components into a compact and reliable structure.
- It streamlines the manufacturing process of antenna systems by simplifying the bonding and encapsulation steps.

Benefits:
- Improved performance and reliability of antenna systems.
- Cost-effective manufacturing process for complex antenna structures.

Commercial Applications:
"Advanced Antenna Integration Method for Wireless Communication Devices"

Frequently Updated Research:
Researchers are continuously exploring new materials and techniques to enhance the performance of integrated antenna systems.

Questions about the technology:
1. How does this method improve the efficiency of antenna systems?
2. What are the key challenges in integrating multiple antenna components into a compact structure?


==Original Abstract Submitted==

A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.



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