View source for 18640207. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

=PRINTED CIRCUIT BOARD=


==Organization Name==

[[:Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.|SAMSUNG ELECTRO-MECHANICS CO., LTD.]]


[[Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.]]

==Inventor(s)==

[[:Category:Jin Uk Lee of Suwon-si (KR)|Jin Uk Lee of Suwon-si (KR)]][[Category:Jin Uk Lee of Suwon-si (KR)]]

[[:Category:Chi Hyeon Jeong of Suwon-si (KR)|Chi Hyeon Jeong of Suwon-si (KR)]][[Category:Chi Hyeon Jeong of Suwon-si (KR)]]

[[:Category:Youn Gyu Han of Suwon-si (KR)|Youn Gyu Han of Suwon-si (KR)]][[Category:Youn Gyu Han of Suwon-si (KR)]]

==PRINTED CIRCUIT BOARD==


This abstract first appeared for US patent application 18640207 titled 'PRINTED CIRCUIT BOARD




==Original Abstract Submitted==

The present disclosure relates to a printed circuit board including: an insulating layer; and a plurality of wiring layers disposed in the insulating layer, wherein the plurality of wiring layers include a first wiring layer, a second wiring layer disposed on the first wiring layer, and a third wiring layer disposed on the second wiring layer, the second wiring layer is thicker than each of the first and third wiring layers, and the second wiring layer includes one or microcircuit patterns and has an aspect ratio, which is a ratio of a height to a line width, being 2.4 to 3.6.



[[Category:H05K1/02]]
[[Category:H05K1/11]]
[[Category:CPC_H05K1/0298]]