View source for 18627195. CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS simplified abstract (Hewlett Packard Enterprise Development LP)

=CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS=


==Organization Name==

[[:Category:Hewlett Packard Enterprise Development LP|Hewlett Packard Enterprise Development LP]]


[[Category:Hewlett Packard Enterprise Development LP]]

==Inventor(s)==

[[:Category:Ernesto Ferrer Medina of Aguadilla (PR)|Ernesto Ferrer Medina of Aguadilla (PR)]][[Category:Ernesto Ferrer Medina of Aguadilla (PR)]]

[[:Category:Harvey J. Lunsman of Chippewa Falls WI (US)|Harvey J. Lunsman of Chippewa Falls WI (US)]][[Category:Harvey J. Lunsman of Chippewa Falls WI (US)]]

[[:Category:Tahir Cader of Liberty Lake WA (US)|Tahir Cader of Liberty Lake WA (US)]][[Category:Tahir Cader of Liberty Lake WA (US)]]

[[:Category:John Franz of Houston TX (US)|John Franz of Houston TX (US)]][[Category:John Franz of Houston TX (US)]]

==CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18627195 titled 'CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS

==Simplified Explanation==
The patent application describes a circuit board cooling apparatus that includes a heat spreader device, a conforming heat transfer device, and a heat transport device to efficiently cool the circuit board.

* The cooling apparatus has a heat spreader device that is thermally coupled with the circuit board's surface.
* A conforming heat transfer device is physically and thermally coupled with the heat spreader device to match its surface contour.
* A heat transport device is attached and thermally coupled with the heat transfer device to effectively dissipate heat from the circuit board.

==Key Features and Innovation==
* Utilizes a heat spreader device to efficiently transfer heat from the circuit board.
* Incorporates a conforming heat transfer device to match the surface contour of the heat spreader device.
* Includes a heat transport device to effectively dissipate heat from the circuit board.

==Potential Applications==
The technology can be applied in various electronic devices and systems that require efficient cooling, such as computers, servers, and industrial equipment.

==Problems Solved==
* Improves thermal management of circuit boards.
* Enhances overall performance and reliability of electronic devices.
* Reduces the risk of overheating and component failure.

==Benefits==
* Efficient cooling of circuit boards.
* Improved performance and reliability of electronic devices.
* Reduced risk of overheating and damage to components.

==Commercial Applications==
* Title: "Advanced Circuit Board Cooling Technology for Enhanced Performance"
* Potential commercial uses include computer systems, servers, telecommunications equipment, and industrial machinery.
* Market implications include improved product reliability, reduced maintenance costs, and increased customer satisfaction.

==Questions about Circuit Board Cooling Technology==
===How does the conforming heat transfer device improve cooling efficiency?===
The conforming heat transfer device matches the surface contour of the heat spreader device, ensuring maximum contact for efficient heat dissipation.

===What are the potential long-term benefits of implementing this cooling technology in electronic devices?===
Implementing this cooling technology can lead to improved device performance, extended lifespan, and reduced maintenance costs over time.


==Original Abstract Submitted==

A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.



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