View source for 18618024. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME simplified abstract (InnoLux Corporation)

=ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME=


==Organization Name==

[[:Category:InnoLux Corporation|InnoLux Corporation]]


[[Category:InnoLux Corporation]]

==Inventor(s)==

[[:Category:Shun-Yuan Hu of Miao-Li County (TW)|Shun-Yuan Hu of Miao-Li County (TW)]][[Category:Shun-Yuan Hu of Miao-Li County (TW)]]

[[:Category:Chin-Lung Ting of Miao-Li County (TW)|Chin-Lung Ting of Miao-Li County (TW)]][[Category:Chin-Lung Ting of Miao-Li County (TW)]]

[[:Category:Li-Wei Mao of Miao-Li County (TW)|Li-Wei Mao of Miao-Li County (TW)]][[Category:Li-Wei Mao of Miao-Li County (TW)]]

[[:Category:Ming-Chun Tseng of Miao-Li County (TW)|Ming-Chun Tseng of Miao-Li County (TW)]][[Category:Ming-Chun Tseng of Miao-Li County (TW)]]

[[:Category:Kung-Chen Kuo of Miao-Li County (TW)|Kung-Chen Kuo of Miao-Li County (TW)]][[Category:Kung-Chen Kuo of Miao-Li County (TW)]]

[[:Category:Yi-Hua Hsu of Miao-Li County (TW)|Yi-Hua Hsu of Miao-Li County (TW)]][[Category:Yi-Hua Hsu of Miao-Li County (TW)]]

[[:Category:Ker-Yih Kao of Miao-Li County (TW)|Ker-Yih Kao of Miao-Li County (TW)]][[Category:Ker-Yih Kao of Miao-Li County (TW)]]

==ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18618024 titled 'ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME

The abstract describes an electrical connection structure that includes conductive particles and a connection pad with three parts, connecting circuits of an array substrate and a circuit substrate.

* The electrical connection structure includes conductive particles and a connection pad with three parts.
* The first part is on the array substrate and connected to a circuit of the array substrate.
* The second part is connected to the first part and passes through the array substrate.
* The third part is connected to the second part and electrically connected to a circuit of a circuit substrate through the conductive particles.

Potential Applications:
- This technology can be used in electronic devices where reliable electrical connections are crucial.
- It can be applied in the manufacturing of circuit boards and semiconductor devices.

Problems Solved:
- Provides a reliable and efficient electrical connection between different substrates.
- Ensures stable and secure connections in electronic devices.

Benefits:
- Enhances the overall performance and reliability of electronic devices.
- Simplifies the manufacturing process of circuit boards and semiconductor devices.

Commercial Applications:
- This technology can be utilized in the production of various electronic devices, improving their functionality and durability.

Questions about Electrical Connection Structure:
1. How does the use of conductive particles improve the electrical connection in this structure?
2. What are the advantages of having a connection pad with three parts in this technology?

Frequently Updated Research:
- Stay updated on the latest advancements in electrical connection structures and their applications in the electronics industry.


==Original Abstract Submitted==

An electrical connection structure is provided. The electrical connection structure includes a plurality of conductive particles and a connection pad including a first part, a second part and a third part. The first part is formed on an array substrate and electrically connected to a circuit of the array substrate. The second part is connected to the first part and passes through the array substrate. The third part is connected to the second part and electrically connected to a circuit of a circuit substrate through the conductive particles.



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