View source for 18615907. THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Jaw-Juinn Horng of Hsinchu (TW)|Jaw-Juinn Horng of Hsinchu (TW)]][[Category:Jaw-Juinn Horng of Hsinchu (TW)]]

[[:Category:Szu-Lin Liu of Hsinchu (TW)|Szu-Lin Liu of Hsinchu (TW)]][[Category:Szu-Lin Liu of Hsinchu (TW)]]

[[:Category:Wei-Lin Lai of Hsinchu (TW)|Wei-Lin Lai of Hsinchu (TW)]][[Category:Wei-Lin Lai of Hsinchu (TW)]]

==THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18615907 titled 'THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME

'''Simplified Explanation''': 

The patent application describes an IC device with a unique heat transfer structure that is electrically isolated from a resistor. The heat transfer structure includes metal segments that help dissipate heat efficiently, while the resistor includes metal segments that are connected to each other through a metal layer below.

'''Key Features and Innovation''':
* Heat transfer structure electrically isolated from a resistor
* Metal segments in the resistor and heat transfer structure for efficient heat dissipation
* Electrically connecting metal segments in the resistor through a metal layer below
* Thermally conductive path from the heat transfer structure to an underlying active area

'''Potential Applications''':
The technology could be used in various electronic devices where efficient heat dissipation is crucial, such as in smartphones, laptops, and other portable electronics.

'''Problems Solved''':
This technology addresses the challenge of managing heat in compact electronic devices, ensuring optimal performance and preventing overheating issues.

'''Benefits''':
* Improved heat dissipation efficiency
* Enhanced overall performance of electronic devices
* Prevention of overheating and potential damage to components

'''Commercial Applications''':
Potential commercial applications include the manufacturing of consumer electronics, industrial equipment, and automotive electronics where heat management is critical for performance and longevity.

'''Prior Art''''':
Readers interested in prior art related to this technology could explore patents and research papers in the field of semiconductor devices, heat dissipation technologies, and integrated circuit design.

'''Frequently Updated Research''':
Stay updated on the latest advancements in heat dissipation technologies, semiconductor materials, and integrated circuit design to further enhance the efficiency and performance of electronic devices.

'''Questions about the Technology''':
1. How does the heat transfer structure in the IC device contribute to overall performance?
2. What are the potential challenges in implementing this technology in different types of electronic devices?


==Original Abstract Submitted==

An IC device includes a heat transfer structure electrically isolated from a resistor. The resistor includes first and second metal segments extending in a first direction in a first metal layer and a third metal segment extending perpendicular to the first direction in a second metal layer below the first metal layer, the third metal segment electrically connecting the first and second metal segments to each other. The heat transfer structure includes fourth and fifth metal segments extending in the first direction in the first metal layer adjacent to the first and second metal segments, sixth and seventh metal segments extending in the second direction in the second metal layer, each of the sixth and seventh metal segments electrically connecting the fourth and fifth metal segments to each other, and a thermally conductive path extending from the sixth or seventh metal segment to an underlying active area.



[[Category:H01L23/367]]
[[Category:H01L23/00]]
[[Category:CPC_H01L23/3677]]