View source for 18615743. COVER FILM simplified abstract (FUJIFILM CORPORATION)

=COVER FILM=


==Organization Name==

[[:Category:FUJIFILM CORPORATION|FUJIFILM CORPORATION]]


[[Category:FUJIFILM CORPORATION]]

==Inventor(s)==

[[:Category:Miyoko Hara of Kanagawa (JP)|Miyoko Hara of Kanagawa (JP)]][[Category:Miyoko Hara of Kanagawa (JP)]]

[[:Category:Takato Suzuki of Kanagawa (JP)|Takato Suzuki of Kanagawa (JP)]][[Category:Takato Suzuki of Kanagawa (JP)]]

[[:Category:Yasuyuki Sasada of Kanagawa (JP)|Yasuyuki Sasada of Kanagawa (JP)]][[Category:Yasuyuki Sasada of Kanagawa (JP)]]

[[:Category:Akio Tamura of Kanagawa (JP)|Akio Tamura of Kanagawa (JP)]][[Category:Akio Tamura of Kanagawa (JP)]]

[[:Category:Reiko Inushima of Kanagawa (JP)|Reiko Inushima of Kanagawa (JP)]][[Category:Reiko Inushima of Kanagawa (JP)]]

==COVER FILM - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18615743 titled 'COVER FILM

The cover film described in the patent application is designed to prevent the generation of chips during cutting, avoid the formation of voids when bonding to a substrate using an enclosing solution, and exhibit excellent adhesiveness with the substrate.

Key Features and Innovation:
* The cover film consists of a support and a polymer layer with a high fracture toughness value of 0.2 MPa·m or more.
* The support has an in-plane retardation of 1,000 nm or less at a wavelength of 590 nm.
* The polymer layer meets specific requirements for dissolution rate in xylene and viscosity of a xylene solution.

Potential Applications:
The cover film can be used for covering test subjects on substrates in various industries such as electronics, medical devices, and research laboratories.

Problems Solved:
The cover film addresses issues related to chip generation during cutting, void formation during bonding, and poor adhesion to substrates.

Benefits:
* Improved cutting process with reduced chip generation.
* Enhanced bonding performance with minimized void formation.
* Excellent adhesion to substrates for secure coverage.

Commercial Applications:
This technology can be applied in the manufacturing of electronic components, medical devices, and research equipment where precise covering and bonding are essential for product quality.

Prior Art:
Readers can explore prior patents related to cover films, polymer layers, and adhesion technologies to understand the background of this innovation.

Frequently Updated Research:
Stay updated on advancements in polymer materials, adhesion science, and substrate bonding techniques to enhance the performance of cover films in various applications.

Questions about Cover Films:
1. How does the fracture toughness value of the polymer layer impact the performance of the cover film?
2. What are the specific requirements for the dissolution rate of the polymer layer in xylene and how does it affect the overall adhesiveness of the cover film?


==Original Abstract Submitted==

An object of the present invention is to provide a cover film in which chips during cutting are unlikely to be generated, voids during bonding to a substrate using an enclosing solution are unlikely to be generated, and adhesiveness with the substrate is excellent. The cover film of the present invention is used for covering a test subject on a substrate, the cover film including a support and a polymer layer containing a polymer, in which a fracture toughness value of the polymer layer is 0.2 MPa·mor more, an in-plane retardation of the support at a wavelength of 590 nm is 1,000 nm or less, and a requirement regarding a dissolution rate of the polymer layer in xylene and a requirement regarding a viscosity of a xylene solution of the polymer layer are satisfied.



[[Category:C08J7/04]]
[[Category:CPC_C08J7/042]]