View source for 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)

=SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Shrenik Kothari of Phoenix AZ (US)|Shrenik Kothari of Phoenix AZ (US)]][[Category:Shrenik Kothari of Phoenix AZ (US)]]

[[:Category:Chandra Mohan Jha of Tempe AZ (US)|Chandra Mohan Jha of Tempe AZ (US)]][[Category:Chandra Mohan Jha of Tempe AZ (US)]]

[[:Category:Weihua Tang of Chandler AZ (US)|Weihua Tang of Chandler AZ (US)]][[Category:Weihua Tang of Chandler AZ (US)]]

[[:Category:Robert Sankman of Phoenix AZ (US)|Robert Sankman of Phoenix AZ (US)]][[Category:Robert Sankman of Phoenix AZ (US)]]

[[:Category:Xavier Brun of Chandler AZ (US)|Xavier Brun of Chandler AZ (US)]][[Category:Xavier Brun of Chandler AZ (US)]]

[[:Category:Pooya Tadayon of Portland OR (US)|Pooya Tadayon of Portland OR (US)]][[Category:Pooya Tadayon of Portland OR (US)]]

==SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18612949 titled 'SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS

'''Simplified Explanation:'''
This patent application describes semiconductor dies with specific layers and a heat spreader attached.

'''Key Features and Innovation:'''
* Semiconductor die with a semiconductor substrate, active device layer, interconnect layer, bonding layers, and a heat spreader attached.
* Active device layer includes one or more transistors.
* Heat spreader improves thermal management of the semiconductor die.

'''Potential Applications:'''
This technology can be used in various electronic devices such as computers, smartphones, and other semiconductor-based products.

'''Problems Solved:'''
This technology addresses the issue of thermal management in semiconductor devices, ensuring efficient operation and longevity.

'''Benefits:'''
* Improved thermal performance
* Enhanced reliability and longevity of semiconductor devices
* Better overall performance of electronic products

'''Commercial Applications:'''
Potential commercial applications include the manufacturing of high-performance electronic devices, data centers, and telecommunications equipment.

'''Prior Art:'''
Readers can explore prior art related to semiconductor die technology in the field of semiconductor manufacturing processes and materials.

'''Frequently Updated Research:'''
Stay updated on the latest research in semiconductor die technology, materials science, and thermal management techniques for electronic devices.

'''Questions about Semiconductor Dies:'''
1. What are the key components of a semiconductor die?
2. How does the heat spreader improve the performance of semiconductor devices?


==Original Abstract Submitted==

Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer comprises one or more transistors, an interconnect layer over a first surface of the active device layer, a first bonding layer over a surface of the semiconductor substrate, a second bonding layer secured to the first bonding layer, and a heat spreader attached to the second bonding layer.



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