View source for 18611075. GRINDING WHEEL (SAMSUNG ELECTRONICS CO., LTD.)

=GRINDING WHEEL=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Sangil Choi of Suwon-si KR|Sangil Choi of Suwon-si KR]][[Category:Sangil Choi of Suwon-si KR]]

[[:Category:Heeseok Nho of Suwon-si KR|Heeseok Nho of Suwon-si KR]][[Category:Heeseok Nho of Suwon-si KR]]

[[:Category:Seonggi Jeon of Suwon-si KR|Seonggi Jeon of Suwon-si KR]][[Category:Seonggi Jeon of Suwon-si KR]]

==GRINDING WHEEL==


This abstract first appeared for US patent application 18611075 titled 'GRINDING WHEEL

==Original Abstract Submitted==

A grinding wheel includes: a wheel body positioned over a wafer; a plurality of wheel tips disposed on the wheel body; and a support block disposed on the wheel body and an outer side surface of each of the wheel tips.



[[Category:B24D7/06]]
[[Category:B24B7/22]]
[[Category:CPC_B24D7/066]]