View source for 18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Shang-Yun Hou of Jubei (TW)|Shang-Yun Hou of Jubei (TW)]][[Category:Shang-Yun Hou of Jubei (TW)]]

[[:Category:Hsien-Pin Hu of Zhubei (TW)|Hsien-Pin Hu of Zhubei (TW)]][[Category:Hsien-Pin Hu of Zhubei (TW)]]

[[:Category:Sao-Ling Chiu of Hsinchu (TW)|Sao-Ling Chiu of Hsinchu (TW)]][[Category:Sao-Ling Chiu of Hsinchu (TW)]]

[[:Category:Wen-Hsin Wei of Hsinchu (TW)|Wen-Hsin Wei of Hsinchu (TW)]][[Category:Wen-Hsin Wei of Hsinchu (TW)]]

[[:Category:Ping-Kang Huang of Chiayi (TW)|Ping-Kang Huang of Chiayi (TW)]][[Category:Ping-Kang Huang of Chiayi (TW)]]

[[:Category:Chih-Ta Shen of Hsinchu (TW)|Chih-Ta Shen of Hsinchu (TW)]][[Category:Chih-Ta Shen of Hsinchu (TW)]]

[[:Category:Szu-Wei Lu of Hsinchu (TW)|Szu-Wei Lu of Hsinchu (TW)]][[Category:Szu-Wei Lu of Hsinchu (TW)]]

[[:Category:Ying-Ching Shih of Hsinchu (TW)|Ying-Ching Shih of Hsinchu (TW)]][[Category:Ying-Ching Shih of Hsinchu (TW)]]

[[:Category:Wen-Chih Chiou of Zhunan Township (TW)|Wen-Chih Chiou of Zhunan Township (TW)]][[Category:Wen-Chih Chiou of Zhunan Township (TW)]]

[[:Category:Chi-Hsi Wu of Hsinchu (TW)|Chi-Hsi Wu of Hsinchu (TW)]][[Category:Chi-Hsi Wu of Hsinchu (TW)]]

[[:Category:Chen-Hua Yu of Hsinchu (TW)|Chen-Hua Yu of Hsinchu (TW)]][[Category:Chen-Hua Yu of Hsinchu (TW)]]

==GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18609836 titled 'GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

The semiconductor structure described in the patent application consists of a first interposer, a second interposer positioned next to the first interposer but spaced apart from it, and a first die attached to both the first and second interposers on one side.

* The innovation involves a unique arrangement of interposers and dies in a semiconductor structure.
* The first die is connected to both interposers, allowing for efficient communication and data transfer.
* This configuration enhances the performance and functionality of the semiconductor device.
* The design enables compact and integrated circuitry, optimizing space utilization.
* The structure potentially improves heat dissipation and overall system reliability.

Potential Applications:
The technology could be applied in high-performance computing systems, data centers, and advanced electronic devices requiring efficient semiconductor solutions.

Problems Solved:
The innovation addresses challenges related to interconnection, data transfer speeds, and space constraints in semiconductor devices.

Benefits:
Improved performance, enhanced functionality, space optimization, increased reliability, and potentially lower production costs.

Commercial Applications:
The technology could be valuable in the development of cutting-edge electronics, server systems, networking equipment, and other high-tech applications.

Questions about the technology:
1. How does the unique arrangement of interposers and dies contribute to the efficiency of the semiconductor structure?
2. What potential impact could this innovation have on the semiconductor industry in terms of performance and cost-effectiveness?


==Original Abstract Submitted==

A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.



[[Category:H01L23/498]]
[[Category:H01L21/48]]
[[Category:H01L21/56]]
[[Category:H01L23/00]]
[[Category:H01L23/31]]
[[Category:H01L23/538]]
[[Category:CPC_H01L23/49816]]