View source for 18605947. Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Sheng-Tsung Hsiao of Taoyuan City (TW)|Sheng-Tsung Hsiao of Taoyuan City (TW)]][[Category:Sheng-Tsung Hsiao of Taoyuan City (TW)]]

[[:Category:Jen Yu Wang of Hsinchu (TW)|Jen Yu Wang of Hsinchu (TW)]][[Category:Jen Yu Wang of Hsinchu (TW)]]

[[:Category:Chung-Jung Wu of Hsinchu (TW)|Chung-Jung Wu of Hsinchu (TW)]][[Category:Chung-Jung Wu of Hsinchu (TW)]]

[[:Category:Tung-Liang Shao of Hsinchu (TW)|Tung-Liang Shao of Hsinchu (TW)]][[Category:Tung-Liang Shao of Hsinchu (TW)]]

[[:Category:Chih-Hang Tung of Hsinchu (TW)|Chih-Hang Tung of Hsinchu (TW)]][[Category:Chih-Hang Tung of Hsinchu (TW)]]

==Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18605947 titled 'Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same

'''Simplified Explanation:'''
This patent application discloses semiconductor devices with lids that have liquid-cooled channels. The devices include a first integrated circuit die, a lid with channels on its surface, a cooling cover, and a heat transfer unit that supplies liquid coolant to the channels.

* The semiconductor device includes a first integrated circuit die.
* The lid is coupled to the first integrated circuit die and has channels on its surface.
* A cooling cover is attached to the lid.
* A heat transfer unit supplies liquid coolant to the channels through the cooling cover.

'''Key Features and Innovation:'''
* Integration of liquid-cooled channels in lids of semiconductor devices.
* Efficient cooling of integrated circuit dies.
* Enhanced heat dissipation capabilities.
* Improved performance and reliability of semiconductor devices.
* Potential for customization and optimization of cooling systems.

'''Potential Applications:'''
* High-performance computing systems.
* Data centers.
* Automotive electronics.
* Aerospace technology.
* Medical devices.

'''Problems Solved:'''
* Overheating of integrated circuit dies.
* Thermal management challenges in semiconductor devices.
* Limitations of traditional air cooling methods.
* Ensuring stable and consistent performance of electronic components.
* Addressing reliability issues due to heat buildup.

'''Benefits:'''
* Improved cooling efficiency.
* Enhanced performance and reliability.
* Extended lifespan of semiconductor devices.
* Customizable cooling solutions.
* Potential for increased processing power.

'''Commercial Applications:'''
The technology can be applied in various industries such as data centers, automotive electronics, and aerospace technology to improve the performance and reliability of semiconductor devices. This innovation has the potential to revolutionize thermal management in electronic systems, leading to more efficient and durable products.

'''Questions about Semiconductor Devices with Liquid-Cooled Channels:'''
1. How does the integration of liquid-cooled channels in lids benefit semiconductor devices?
2. What are the potential applications of this technology in different industries?


==Original Abstract Submitted==

Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.



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[[Category:H01L21/48]]
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