View source for 18603515. ELECTRONIC COMPONENT STRUCTURE simplified abstract (TDK CORPORATION)

=ELECTRONIC COMPONENT STRUCTURE=


==Organization Name==

[[:Category:TDK CORPORATION|TDK CORPORATION]]


[[Category:TDK CORPORATION]]

==Inventor(s)==

[[:Category:Toshihiro Iguchi of Tokyo (JP)|Toshihiro Iguchi of Tokyo (JP)]][[Category:Toshihiro Iguchi of Tokyo (JP)]]

[[:Category:Tomohisa Fukuoka of Tokyo (JP)|Tomohisa Fukuoka of Tokyo (JP)]][[Category:Tomohisa Fukuoka of Tokyo (JP)]]

==ELECTRONIC COMPONENT STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18603515 titled 'ELECTRONIC COMPONENT STRUCTURE

The abstract of the patent application describes an electronic component structure that includes a first electronic component, a second electronic component, a low melting point layer containing a first metal material with a melting point of 300°C or lower, and a high melting point layer containing a second metal material with a melting point of 400°C or higher. The first and second electronic components are connected by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.

* The electronic component structure includes a low melting point layer with a first metal material and a high melting point layer with a second metal material.
* The first and second electronic components are connected by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.
* The first metal material in the low melting point layer has a melting point of 300°C or lower.
* The second metal material in the high melting point layer has a melting point of 400°C or higher.

Potential Applications:
- This technology could be used in electronic devices to improve connectivity and reliability.
- It may find applications in the automotive industry for enhanced electronic component structures.

Problems Solved:
- Provides a reliable and efficient way to connect electronic components.
- Helps in reducing the risk of damage due to overheating.

Benefits:
- Improved connectivity between electronic components.
- Enhanced durability and reliability of electronic devices.

Commercial Applications:
- This technology could be valuable in the manufacturing of consumer electronics, automotive electronics, and industrial equipment.

Questions about the technology:
1. How does the multilayer connection portion improve the performance of electronic components?
2. What are the potential challenges in implementing this technology in different industries?


==Original Abstract Submitted==

An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300° C. or lower; and a high melting point layer located between the first electronic component and the second electronic component and containing a second metal material having a melting point of 400° C. or higher. In the electronic component structure, the first electronic component and the second electronic component are connected to each other by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.



[[Category:H01G4/232]]
[[Category:H01G4/30]]
[[Category:CPC_H01G4/2325]]