View source for 18603047. ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

=ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK=


==Organization Name==

[[:Category:TEXAS INSTRUMENTS INCORPORATED|TEXAS INSTRUMENTS INCORPORATED]]


[[Category:TEXAS INSTRUMENTS INCORPORATED]]

==Inventor(s)==

[[:Category:Vivek K. Arora of San Jose CA (US)|Vivek K. Arora of San Jose CA (US)]][[Category:Vivek K. Arora of San Jose CA (US)]]

[[:Category:Woochan Kim of San Jose CA (US)|Woochan Kim of San Jose CA (US)]][[Category:Woochan Kim of San Jose CA (US)]]

==ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18603047 titled 'ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK

The power converter package described in the patent application includes a leadframe with first and second die pads, supports connected to first leads and second leads, and two semiconductor dies with bond pads on the respective die pads. A transformer stack with a coil and coil contacts is sandwiched between a top and bottom magnetic sheet, with a silicon block attached to the bottom magnetic sheet. Bond wires connect the bond pads to the leads and coil contacts, and the entire assembly is encapsulated in mold, leaving the bottom of the silicon block exposed.

* Leadframe with first and second die pads
* Supports connected to first leads and second leads
* Two semiconductor dies with bond pads
* Transformer stack with coil and coil contacts
* Top and bottom magnetic sheets
* Silicon block attached to bottom magnetic sheet
* Bond wires connecting bond pads to leads and coil contacts
* Mold encapsulation leaving bottom of silicon block exposed

Potential Applications:
- Power converters
- Electronic devices
- Renewable energy systems

Problems Solved:
- Efficient power conversion
- Compact packaging of components
- Improved thermal management

Benefits:
- Higher efficiency
- Space-saving design
- Enhanced reliability

Commercial Applications:
Title: Innovative Power Converter Package for Electronic Devices
This technology can be utilized in various electronic devices such as smartphones, laptops, and power supplies. It can also be integrated into renewable energy systems for improved energy conversion.

Questions about the technology:
1. How does the transformer stack contribute to the efficiency of the power converter package?
2. What are the advantages of using a leadframe in this design?


==Original Abstract Submitted==

A power converter package includes a leadframe including first and second die pads, and supports connected to first leads, and second leads. A first semiconductor die including first bond pads is on the first die pad, and a second semiconductor die including second bond pads is on the second die pad. A transformer stack includes a top magnetic sheet and a bottom magnetic sheet on respective sides of a laminate substrate that includes a coil within, and coil contacts. A silicon block is attached to the bottom magnetic sheet and edges of the laminate substrate are attached to the supports. Bond wires are between the first bond pads and the second leads, the second bond pads and the second leads, and the first and second bond pads and the coil contacts. Mold encapsulates the respective semiconductor and the transformer stack. A bottom of the silicon block is exposed from the mold.



[[Category:H01L23/495]]
[[Category:H01F27/28]]
[[Category:H01L21/56]]
[[Category:H01L23/00]]
[[Category:H01L23/31]]
[[Category:H01L23/373]]
[[Category:CPC_H01L23/49575]]