View source for 18602732. FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE simplified abstract (CANON KABUSHIKI KAISHA)

=FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE=


==Organization Name==

[[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]


[[Category:CANON KABUSHIKI KAISHA]]

==Inventor(s)==

[[:Category:TAKAMITSU Tokuda of Kanagawa (JP)|TAKAMITSU Tokuda of Kanagawa (JP)]][[Category:TAKAMITSU Tokuda of Kanagawa (JP)]]

==FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18602732 titled 'FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE

The abstract describes a flexible electric wiring substrate with multiple groups, each containing wiring, a connector land, a pad, and a plating lead for current supply during electrolytic plating.

* The substrate includes wiring, connector lands, pads, and plating leads for current supply during electrolytic plating.
* Multiple plating leads are arranged for inspection probes to be abutted onto each lead.
* The substrate offers flexibility and versatility in electric wiring applications.
* The design allows for efficient and effective plating processes on electronic parts.
* The innovation enhances the functionality and reliability of electric wiring systems.

Potential Applications:
- Electronics manufacturing
- Automotive industry
- Aerospace technology
- Medical devices
- Consumer electronics

Problems Solved:
- Simplifies the process of electric wiring and plating
- Enhances the reliability of connections
- Improves efficiency in manufacturing electronic devices

Benefits:
- Increased flexibility in wiring applications
- Enhanced reliability of electrical connections
- Improved efficiency in plating processes
- Cost-effective solution for electronic manufacturing

Commercial Applications:
"Flexible Electric Wiring Substrate for Enhanced Plating Processes in Various Industries"

Questions about the technology:
1. How does the design of the substrate improve the efficiency of plating processes?
2. What are the key advantages of using this flexible electric wiring substrate in electronics manufacturing?


==Original Abstract Submitted==

Provided is a flexible electric wiring substrate including multiple groups each including wiring, a connector land that electrically connects a terminal of a connector to the wiring, a pad that connects a terminal of an electronic part to the wiring, and a plating lead that is electrically connected with the pad through the wiring and is used as a current supply port at least in a case of electrolytic plating of the pad, in which the multiple plating leads are arranged such that each of multiple inspection probes arrayed on a probe holding substrate is abutted onto each plating lead.



[[Category:B41J2/14]]
[[Category:B41J2/16]]
[[Category:G01R31/28]]
[[Category:CPC_B41J2/14201]]