View source for 18601880. IMAGE FORMING SYSTEM AND SHEET PROCESSING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)

=IMAGE FORMING SYSTEM AND SHEET PROCESSING APPARATUS=


==Organization Name==

[[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]


[[Category:CANON KABUSHIKI KAISHA]]

==Inventor(s)==

[[:Category:KENICHIROU Isobe of Kanagawa (JP)|KENICHIROU Isobe of Kanagawa (JP)]][[Category:KENICHIROU Isobe of Kanagawa (JP)]]

==IMAGE FORMING SYSTEM AND SHEET PROCESSING APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18601880 titled 'IMAGE FORMING SYSTEM AND SHEET PROCESSING APPARATUS

The patent application describes an image forming system with an image forming apparatus and a sheet processing apparatus that includes a stacking unit, a moving unit, and a thermal compression bonding unit.

* The stacking unit has a stack of plural sheets with an adhesive layer for bonding them together.
* The thermal compression bonding unit includes a heating member with a heat generation area.
* When the length of the adhesive layer in the longer-side direction is greater than the heat generation area, the entire adhesive layer is heated and pressed more than once by changing the relative position of the sheets and the heat generation area.

Potential Applications:
- Printing industry for creating multi-layered documents or images.
- Manufacturing industry for bonding materials together in a precise manner.

Problems Solved:
- Efficiently bonding multiple sheets together with precision.
- Ensuring uniform heating and pressing of adhesive layers.

Benefits:
- Improved quality of bonded materials.
- Increased efficiency in the bonding process.

Commercial Applications:
Thermal compression bonding technology can be used in industries such as printing, packaging, and manufacturing for creating high-quality, multi-layered products.

Questions about Thermal Compression Bonding Technology:
1. How does thermal compression bonding compare to other bonding methods like adhesives or mechanical fasteners?
2. What are the key factors to consider when optimizing the heating and pressing process in thermal compression bonding?

Frequently Updated Research:
Researchers are constantly exploring new materials and techniques to enhance the efficiency and quality of thermal compression bonding processes. Stay updated on the latest advancements in this field for potential improvements in various industries.


==Original Abstract Submitted==

An image forming system includes an image forming apparatus and a sheet processing apparatus having a stacking unit, a moving unit, and a thermal compression bonding unit. The stacking unit includes a stack of plural sheet having an adhesive layer for bonding the plural sheets together. The thermal compression bonding unit includes a heating member having a heat generation area. In a case where a length of the adhesive layer regarding a longer-side direction of the heating member is greater than a length of the heat generation area, an entire area of the adhesive layer on the plural sheets is heated and pressed by applying heat and pressure to the adhesive layer more than once while changing, via the moving unit, a relative position of the plural sheets having been conveyed onto the stacking unit and the heat generation area regarding the longer-side direction of the heating member.



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