View source for 18596399. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (Advanced Semiconductor Engineering, Inc.)

=SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Advanced Semiconductor Engineering, Inc.|Advanced Semiconductor Engineering, Inc.]]


[[Category:Advanced Semiconductor Engineering, Inc.]]

==Inventor(s)==

[[:Category:Hsin He Huang of Kaohsiung (TW)|Hsin He Huang of Kaohsiung (TW)]][[Category:Hsin He Huang of Kaohsiung (TW)]]

==SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18596399 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

'''Simplified Explanation:'''
The semiconductor device described in the patent application includes a semiconductor die with conductive pillars and supporters on different regions of its surface.

* The semiconductor device has a semiconductor die with a first surface and a second surface.
* There are multiple conductive pillars on the first surface in one region.
* Adjacent to this region, there are supporters in another region.
* The density of supporters in the second region is between 50% to 100% of the density of conductive pillars in the first region.
* The patent also covers a method for manufacturing a semiconductor package with this semiconductor device.

'''Key Features and Innovation:'''
* Semiconductor device with conductive pillars and supporters on different regions of the die.
* Specific density ratio between supporters and conductive pillars.
* Method for manufacturing a semiconductor package using this device.

'''Potential Applications:'''
* Semiconductor manufacturing industry.
* Electronics and technology sectors.

'''Problems Solved:'''
* Efficient distribution of support for conductive pillars.
* Enhanced structural integrity of semiconductor devices.

'''Benefits:'''
* Improved reliability of semiconductor packages.
* Better performance due to optimized support structure.

'''Commercial Applications:'''
* Semiconductor manufacturing companies.
* Electronics manufacturers.

'''Prior Art:'''
Prior art related to semiconductor packaging and support structures in semiconductor devices.

'''Frequently Updated Research:'''
Ongoing research in semiconductor packaging techniques and support structures.

'''Questions about Semiconductor Device:'''
1. How does the density ratio of supporters to conductive pillars impact the performance of the semiconductor device?
2. What are the potential challenges in manufacturing semiconductor packages using this innovative support structure?


==Original Abstract Submitted==

A semiconductor device includes a semiconductor die having a first surface and a second surface opposite to the first surface, a plurality of first real conductive pillars in a first region on the first surface, and a plurality of supporters in a second region adjacent to the first region. An area density of the plurality of supporters in the second region is in a range of from about 50% to about 100% to an area density of the plurality of first real conductive pillars in the first region. A method for manufacturing a semiconductor package including the semiconductor device is also disclosed in the present disclosure.



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