View source for 18592336. Plasma Processing Apparatus simplified abstract (Tokyo Electron Limited)

=Plasma Processing Apparatus=


==Organization Name==

[[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]


[[Category:Tokyo Electron Limited]]

==Inventor(s)==

[[:Category:Taro Hayakawa of Yamanashi (JP)|Taro Hayakawa of Yamanashi (JP)]][[Category:Taro Hayakawa of Yamanashi (JP)]]

[[:Category:Taro Ikeda of Yamanashi (JP)|Taro Ikeda of Yamanashi (JP)]][[Category:Taro Ikeda of Yamanashi (JP)]]

[[:Category:Eiki Kamata of Yamanashi (JP)|Eiki Kamata of Yamanashi (JP)]][[Category:Eiki Kamata of Yamanashi (JP)]]

==Plasma Processing Apparatus - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18592336 titled 'Plasma Processing Apparatus

The abstract describes a plasma processing apparatus with a dielectric ceiling plate that separates an inner space and an outer space of the processing chamber, along with electromagnetic wave supplies to supply waves into the chamber.

* The apparatus includes a processing chamber with an upper opening and a dielectric ceiling plate that partitions the inner and outer spaces.
* Multiple electromagnetic wave supplies are placed on the ceiling plate to introduce waves into the chamber.
* A cavity is present between the electromagnetic wave supplies on the ceiling plate, either on the surface in contact with the outer space or inside the plate itself.

Potential Applications:
- Semiconductor manufacturing
- Thin film deposition
- Surface modification processes

Problems Solved:
- Enhanced control over plasma processing
- Improved uniformity of treatment on substrates

Benefits:
- Increased efficiency in plasma processing
- Better quality and consistency of treated materials

Commercial Applications:
Title: Advanced Plasma Processing Apparatus for Semiconductor Manufacturing
This technology can be utilized in semiconductor fabrication facilities to improve the quality and efficiency of processing operations, potentially leading to cost savings and enhanced product performance.

Prior Art:
Researchers can explore prior patents related to plasma processing apparatuses, dielectric ceiling plates, and electromagnetic wave supplies to understand the evolution of this technology.

Frequently Updated Research:
Researchers in the field of plasma processing continue to explore novel methods for enhancing the performance and capabilities of plasma processing apparatuses, including the integration of advanced materials and control systems.

Questions about Plasma Processing Apparatus:
1. How does the dielectric ceiling plate contribute to the efficiency of plasma processing?
The dielectric ceiling plate helps to separate the inner and outer spaces of the processing chamber, allowing for better control and uniformity in the treatment of substrates.

2. What are the key advantages of using electromagnetic wave supplies in plasma processing?
Electromagnetic wave supplies enable precise control over the energy input into the plasma, leading to improved process outcomes and material properties.


==Original Abstract Submitted==

A plasma processing apparatus comprises a processing chamber having an upper opening, a dielectric ceiling plate that is disposed to close the opening and partitions an inner space and an outer space of the processing chamber, and a plurality of electromagnetic wave supplies disposed on the dielectric ceiling plate and configured to supply electromagnetic waves into the processing chamber. The dielectric ceiling plate has a cavity between the plurality of electromagnetic wave supplies. The cavity is formed in a surface of the dielectric ceiling plate in contact with the outer space or formed inside the dielectric ceiling plate.



[[Category:H01J37/32]]
[[Category:CPC_H01J37/3222]]