View source for 18590242. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)

=INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]

==Inventor(s)==

[[:Category:John Jianhong Zhu of San Diego CA (US)|John Jianhong Zhu of San Diego CA (US)]][[Category:John Jianhong Zhu of San Diego CA (US)]]

[[:Category:Junjing Bao of San Diego CA (US)|Junjing Bao of San Diego CA (US)]][[Category:Junjing Bao of San Diego CA (US)]]

[[:Category:Giridhar Nallapati of San Diego CA (US)|Giridhar Nallapati of San Diego CA (US)]][[Category:Giridhar Nallapati of San Diego CA (US)]]

==INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18590242 titled 'INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS

==Simplified Explanation==
This patent application describes integrated circuits (ICs) that use directly coupled metal lines between vertically-adjacent interconnect layers to reduce coupling resistance. This means that there is no intermediate vertical interconnect access layer with vias connecting the metal lines in different layers.

* Metal lines in overlying and underlying interconnect layers are directly coupled without the need for an intermediate via layer.

==Key Features and Innovation==
* Integrated circuits with directly coupled metal lines between vertically-adjacent interconnect layers.
* Reduction of coupling resistance in ICs.
* Elimination of the need for an intermediate vertical interconnect access layer with vias.
* Improved performance and efficiency of ICs.
* Related fabrication methods for implementing this innovation.

==Potential Applications==
This technology can be applied in various electronic devices and systems that use integrated circuits, such as smartphones, computers, and IoT devices.

==Problems Solved==
* Reduced coupling resistance in ICs.
* Simplified interconnect design.
* Improved signal integrity and performance.

==Benefits==
* Enhanced efficiency and performance of integrated circuits.
* Simplified fabrication processes.
* Cost-effective production of ICs.
* Improved reliability and signal integrity.

==Commercial Applications==
This technology has potential commercial applications in the semiconductor industry, specifically in the production of advanced integrated circuits for consumer electronics, telecommunications, and other high-tech devices.

==Prior Art==
Further research can be conducted on previous patents related to directly coupled metal lines in integrated circuits to understand the evolution of this technology.

==Frequently Updated Research==
Researchers are continually exploring new methods and materials to further enhance the performance and efficiency of integrated circuits with directly coupled metal lines.

==Questions about Integrated Circuits with Directly Coupled Metal Lines==
===What are the potential challenges in implementing directly coupled metal lines in integrated circuits?===
Implementing directly coupled metal lines in integrated circuits may require precise manufacturing processes to ensure proper alignment and connectivity between the metal lines in different layers.

===How does the reduction of coupling resistance in ICs impact overall circuit performance?===
Reducing coupling resistance in ICs can lead to improved signal integrity, reduced power consumption, and enhanced overall performance of electronic devices that use these integrated circuits.


==Original Abstract Submitted==

Integrated circuits (ICs), including capacitors and inductors, employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related fabrication methods. By directly coupled, it is meant that there is not an intermediate vertical interconnect access (via) layer with a via(s) interconnecting the metal lines in vertically-adjacent interconnect layers. An overlying and underlying metal line in respective and vertically-adjacent overlying and underlying interconnect layers are directly coupled to each other without the need for an intermediate via layer.



[[Category:H01L23/522]]
[[Category:H01L23/00]]
[[Category:CPC_H01L23/5223]]