View source for 18585629. PROCESS FOR THIN FILM CAPACITOR INTEGRATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

=PROCESS FOR THIN FILM CAPACITOR INTEGRATION=


==Organization Name==

[[:Category:TEXAS INSTRUMENTS INCORPORATED|TEXAS INSTRUMENTS INCORPORATED]]


[[Category:TEXAS INSTRUMENTS INCORPORATED]]

==Inventor(s)==

[[:Category:Benjamin Stassen Cook of Los Gatos CA (US)|Benjamin Stassen Cook of Los Gatos CA (US)]][[Category:Benjamin Stassen Cook of Los Gatos CA (US)]]

[[:Category:Yogesh Kumar Ramadass of San Jose CA (US)|Yogesh Kumar Ramadass of San Jose CA (US)]][[Category:Yogesh Kumar Ramadass of San Jose CA (US)]]

[[:Category:Salvatore Frank Pavone of Murphy TX (US)|Salvatore Frank Pavone of Murphy TX (US)]][[Category:Salvatore Frank Pavone of Murphy TX (US)]]

[[:Category:Mahmud Halim Chowdhury of Richardson TX (US)|Mahmud Halim Chowdhury of Richardson TX (US)]][[Category:Mahmud Halim Chowdhury of Richardson TX (US)]]

==PROCESS FOR THIN FILM CAPACITOR INTEGRATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18585629 titled 'PROCESS FOR THIN FILM CAPACITOR INTEGRATION

==Simplified Explanation==
The patent application describes an integrated circuit (IC) with various components such as conductive lines, insulation blocks, metal pillars, and a lead frame. The IC also includes a capacitor connected using conductive adhesive.

* Silicon wafer with conductive lines
* Insulation blocks on the conductive lines
* Metal pillar and conductive adhesive block
* Lead frame with leads
* Capacitor connected with conductive adhesive

==Key Features and Innovation==
* Integration of various components in an IC design
* Use of conductive adhesive for connecting components
* Efficient layout for improved circuit performance

==Potential Applications==
The technology can be used in various electronic devices such as smartphones, computers, and automotive systems.

==Problems Solved==
* Simplified circuit design
* Enhanced connectivity between components
* Improved overall performance of the IC

==Benefits==
* Compact and efficient IC design
* Reliable connections between components
* Enhanced functionality of electronic devices

==Commercial Applications==
The technology can be applied in the semiconductor industry for manufacturing advanced electronic devices with improved performance and reliability.

==Prior Art==
Readers can explore prior patents related to integrated circuit design, conductive adhesive applications, and lead frame technologies for further insights.

==Frequently Updated Research==
Stay updated on advancements in IC design, conductive adhesive technologies, and semiconductor manufacturing processes for potential improvements in the field.

==Questions about Integrated Circuits==
===What are the key components of an integrated circuit?===
An integrated circuit typically consists of silicon wafers, conductive lines, insulation blocks, and various electronic components integrated into a single chip.

===How does conductive adhesive improve circuit connections?===
Conductive adhesive provides a reliable and efficient way to connect components in an integrated circuit, ensuring stable electrical connections for optimal performance.


==Original Abstract Submitted==

Disclosed embodiments include an integrated circuit (IC) comprising a silicon wafer, first and second conductive lines on the silicon wafer. There are first, second and third insulation blocks with portions on the first and second conductive lines and the silicon wafer, a metal pillar on the surface of the first conductive line opposite the silicon wafer, and a conductive adhesive block on the surface of the second conductive line opposite the silicon wafer. The IC also has a lead frame having first and second leads, and a capacitor having first and second capacitor terminals in which the first capacitor terminal is connected to the second lead using conductive adhesive, the second capacitor terminal is connected to the second conductive line through the conductive adhesive block, and the first lead is coupled to the first conductive line.



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