View source for 18583664. MODULAR SUBSTRATE SUPPORT ASSEMBLY (Applied Materials, Inc.)

=MODULAR SUBSTRATE SUPPORT ASSEMBLY=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Arvinder Manmohan Singh Chadha of San Jose CA US|Arvinder Manmohan Singh Chadha of San Jose CA US]][[Category:Arvinder Manmohan Singh Chadha of San Jose CA US]]

[[:Category:Vijay D. Parkhe of San Jose CA US|Vijay D. Parkhe of San Jose CA US]][[Category:Vijay D. Parkhe of San Jose CA US]]

[[:Category:Glen T. Mori of Gilroy CA US|Glen T. Mori of Gilroy CA US]][[Category:Glen T. Mori of Gilroy CA US]]

[[:Category:Christopher Laurent Beaudry of San Jose CA US|Christopher Laurent Beaudry of San Jose CA US]][[Category:Christopher Laurent Beaudry of San Jose CA US]]

==MODULAR SUBSTRATE SUPPORT ASSEMBLY==


This abstract first appeared for US patent application 18583664 titled 'MODULAR SUBSTRATE SUPPORT ASSEMBLY

==Original Abstract Submitted==

An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.



[[Category:H01L21/687]]
[[Category:H01L21/67]]
[[Category:H01L21/683]]
[[Category:CPC_H01L21/68785]]