View source for 18578753. IMPRINTING APPARATUS simplified abstract (KONINKLIJKE PHILIPS N.V.)

=IMPRINTING APPARATUS=


==Organization Name==

[[:Category:KONINKLIJKE PHILIPS N.V.|KONINKLIJKE PHILIPS N.V.]]


[[Category:KONINKLIJKE PHILIPS N.V.]]

==Inventor(s)==

[[:Category:Didier Mathijs Maria Justina Petit of Aachen (DE)|Didier Mathijs Maria Justina Petit of Aachen (DE)]][[Category:Didier Mathijs Maria Justina Petit of Aachen (DE)]]

[[:Category:Johammes Balthasar Maria Soetens of Eindhoven (NL)|Johammes Balthasar Maria Soetens of Eindhoven (NL)]][[Category:Johammes Balthasar Maria Soetens of Eindhoven (NL)]]

[[:Category:Thomas Petrus Hendricus Warmerdam of Eindhoven (NL)|Thomas Petrus Hendricus Warmerdam of Eindhoven (NL)]][[Category:Thomas Petrus Hendricus Warmerdam of Eindhoven (NL)]]

[[:Category:Marcus Antonius Verschuuren of Eindhoven (NL)|Marcus Antonius Verschuuren of Eindhoven (NL)]][[Category:Marcus Antonius Verschuuren of Eindhoven (NL)]]

==IMPRINTING APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18578753 titled 'IMPRINTING APPARATUS

The abstract describes an imprinting apparatus with a first carrier for a flexible stamp and a second carrier for a substrate with a resist layer. The second carrier includes a chuck with a hollow cylindrical body and a lattice arrangement for maintaining a uniform imprint gap.

* The imprinting apparatus includes a first carrier for a flexible stamp and a second carrier for a substrate with a resist layer.
* The chuck in the second carrier has a hollow cylindrical body with a lattice arrangement for maintaining a uniform imprint gap.
* The chuck has a reduced thermal mass while still providing the necessary stiffness for the imprinting process.
* This innovation allows for precise and consistent imprints on substrates with resist layers.
* The apparatus is designed to improve the efficiency and accuracy of imprinting processes in manufacturing.

Potential Applications:
- Semiconductor manufacturing
- Nanotechnology research
- Optical device fabrication

Problems Solved:
- Inconsistent imprinting results
- Difficulty in maintaining a uniform imprint gap
- Issues with thermal mass affecting imprinting accuracy

Benefits:
- Improved precision in imprinting processes
- Enhanced efficiency in manufacturing
- Consistent and reliable results

Commercial Applications:
Title: Advanced Imprinting Apparatus for Semiconductor Manufacturing
This technology can be used in the production of semiconductors, nanotechnology research, and optical device fabrication. It offers improved precision and efficiency in imprinting processes, making it valuable in various commercial applications.

Questions about Imprinting Apparatus:
1. How does the reduced thermal mass of the chuck in the second carrier impact the imprinting process?
The reduced thermal mass helps maintain a consistent temperature during imprinting, leading to more accurate and reliable results.

2. What are the potential challenges in implementing this imprinting apparatus in large-scale manufacturing processes?
Large-scale implementation may require adjustments for specific substrates and resist layers, as well as considerations for production efficiency and cost-effectiveness.


==Original Abstract Submitted==

An imprinting apparatus comprises a first carrier for carrying a flexible stamp and a second carrier movable relative to the first carrier and configured to carry a substrate having a resist layer. The second carrier comprises a chuck which comprises a hollow cylindrical body having a top face and a bottom face and a lattice arrangement between the top and bottom faces. The chuck has a reduced thermal mass while maintaining the required stiffness for maintaining a uniform imprint gap.



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