View source for 18562502. SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)

=SUBSTRATE PROCESSING METHOD=


==Organization Name==

[[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]


[[Category:Tokyo Electron Limited]]

==Inventor(s)==

[[:Category:Yoshihisa Matsubara of Tokyo (JP)|Yoshihisa Matsubara of Tokyo (JP)]][[Category:Yoshihisa Matsubara of Tokyo (JP)]]

[[:Category:Yoshihiro Tsutsumi of Tokyo (JP)|Yoshihiro Tsutsumi of Tokyo (JP)]][[Category:Yoshihiro Tsutsumi of Tokyo (JP)]]

[[:Category:Yohei Yamashita of Kumamoto (JP)|Yohei Yamashita of Kumamoto (JP)]][[Category:Yohei Yamashita of Kumamoto (JP)]]

==SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18562502 titled 'SUBSTRATE PROCESSING METHOD

The substrate processing method described in the patent application involves several key processes. 

* The first process involves preparing a laminated substrate with specific layers in a particular order. 
* The second process includes irradiating laser light onto the first substrate from the opposite side of the second substrate. 
* The third process entails irradiating the laser light transmitted through the first substrate onto the first absorption layer to create a modified layer. 
* The final process separates the first and second substrates using the modified layer as a starting point. 

Key Features and Innovation:
- The method involves the use of specific absorption layers to manipulate laser light for substrate processing. 
- The process of creating a modified layer allows for efficient separation of substrates. 
- The use of laser light in this manner enhances precision and control in substrate processing. 

Potential Applications:
- This technology can be applied in the manufacturing of electronic devices, solar panels, and other high-precision components. 
- It can also be used in the production of flexible displays, sensors, and microelectronics. 

Problems Solved:
- This method addresses the challenge of separating laminated substrates without damaging the layers. 
- It provides a precise and controlled way to process substrates for various applications. 

Benefits:
- Improved efficiency and accuracy in substrate processing. 
- Enhanced control over the separation of laminated substrates. 
- Potential for cost savings and increased productivity in manufacturing processes. 

Commercial Applications:
- The technology can be utilized in the electronics industry for the production of advanced devices. 
- It has potential applications in the renewable energy sector for manufacturing solar panels. 

Questions about the technology:
1. How does the use of specific absorption layers impact the efficiency of laser light manipulation in substrate processing?
2. What are the potential cost-saving benefits of implementing this method in manufacturing processes?


==Original Abstract Submitted==

The substrate processing method includes processes (A) to (D). The process (A) prepares a laminated substrate including a first substrate, a first absorption layer that absorbs laser light, a second absorption layer having an absorption coefficient with respect to the laser light higher than that of the first absorption layer, a device layer, and a second substrate in this order. The process (B) irradiates the laser light with respect to the first substrate from a side opposite to the second substrate. The process (C) irradiates the laser light transmitted through the first substrate on the first absorption layer, to form a modified layer in the first absorption layer. The process (D) separates the first substrate and the second substrate from each other using the modified layer as a starting point.



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