View source for 18562372. SUBSTRATES FOR LED DISPLAY HEAT DISSIPATION simplified abstract (CORNING INCORPORATED)

=SUBSTRATES FOR LED DISPLAY HEAT DISSIPATION=


==Organization Name==

[[:Category:CORNING INCORPORATED|CORNING INCORPORATED]]


[[Category:CORNING INCORPORATED]]

==Inventor(s)==

[[:Category:SEAN MATTHEW Garner of ELMIRA NY (US)|SEAN MATTHEW Garner of ELMIRA NY (US)]][[Category:SEAN MATTHEW Garner of ELMIRA NY (US)]]

[[:Category:DAVID ROBERT Heine of SEMINOLE FL (US)|DAVID ROBERT Heine of SEMINOLE FL (US)]][[Category:DAVID ROBERT Heine of SEMINOLE FL (US)]]

[[:Category:DEAN MICHAEL Thelen of ADDISON NY (US)|DEAN MICHAEL Thelen of ADDISON NY (US)]][[Category:DEAN MICHAEL Thelen of ADDISON NY (US)]]

==SUBSTRATES FOR LED DISPLAY HEAT DISSIPATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18562372 titled 'SUBSTRATES FOR LED DISPLAY HEAT DISSIPATION

The patent application describes apparatuses and methods for controlling heat dissipation from semiconductor devices such as LEDs to reduce temperature increases during operation.

* Substrate structure with fins positioned along one side to dissipate heat effectively.
* Heating sources positioned on the other side of the substrate structure, laterally offset from the fins.
* LEDs positioned along the side with fins, partially in line with the fins for efficient heat dissipation.
* LEDs may also be laterally offset from the fins for optimized heat control.

Potential Applications:
- LED lighting systems
- Electronic displays
- Automotive lighting

Problems Solved:
- Overheating of semiconductor devices
- Inefficient heat dissipation
- Shortened lifespan of LEDs due to high temperatures

Benefits:
- Improved thermal management
- Enhanced performance and longevity of semiconductor devices
- Energy efficiency

Commercial Applications:
Title: "Advanced Thermal Management Solutions for Semiconductor Devices"
This technology can be utilized in various industries such as lighting, electronics, and automotive for improved heat dissipation and performance.

Questions about the technology:
1. How does the placement of fins and heating sources contribute to effective heat dissipation?
- The fins help to dissipate heat efficiently, while the offset positioning of heating sources prevents overheating of the semiconductor devices.
2. What are the potential long-term benefits of implementing this heat dissipation design in LED lighting systems?
- By effectively managing heat, the LEDs can operate at optimal temperatures, leading to improved performance and longevity.


==Original Abstract Submitted==

Apparatuses and methods are described for substrate materials and designs for controlling heat dissipation from semiconductor devices such as light-emitting diodes (LEDs). The embodiments may reduce temperature increases of semiconductor devices during operation. In some examples, a substrate structure is manufactured with a plurality of fins positioned along a first side. A plurality of heating sources, such as electronic components that generate heat, may be positioned along a second side of the substrate structure. The plurality of heat sources may be positioned to be laterally offset from the plurality of fins. In some examples, a plurality of LEDs are positioned along the first side of the substrate structure and at least partially laterally in line with the plurality of fins. In some examples, the plurality of LEDs are positioned along the first side of the substrate structure and laterally offset from the plurality of fins.



[[Category:H01L33/64]]
[[Category:H01L25/075]]
[[Category:CPC_H01L33/642]]