View source for 18542665. SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD simplified abstract (SEMES CO., LTD.)

=SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD=


==Organization Name==

[[:Category:SEMES CO., LTD.|SEMES CO., LTD.]]


[[Category:SEMES CO., LTD.]]

==Inventor(s)==

[[:Category:Young Eun Jeon of Ulsan-si (KR)|Young Eun Jeon of Ulsan-si (KR)]][[Category:Young Eun Jeon of Ulsan-si (KR)]]

[[:Category:Yun Sang Kim of Seongnam-si (KR)|Yun Sang Kim of Seongnam-si (KR)]][[Category:Yun Sang Kim of Seongnam-si (KR)]]

[[:Category:Min Sung Jeon of Osan-si (KR)|Min Sung Jeon of Osan-si (KR)]][[Category:Min Sung Jeon of Osan-si (KR)]]

[[:Category:Tae Hwan Lee of Cheonan-si (KR)|Tae Hwan Lee of Cheonan-si (KR)]][[Category:Tae Hwan Lee of Cheonan-si (KR)]]

[[:Category:Sung Min Choi of Osan-si (KR)|Sung Min Choi of Osan-si (KR)]][[Category:Sung Min Choi of Osan-si (KR)]]

[[:Category:Jin Hee Hong of Hwaseong-si (KR)|Jin Hee Hong of Hwaseong-si (KR)]][[Category:Jin Hee Hong of Hwaseong-si (KR)]]

[[:Category:Dong Young Jang of Seongnam-si (KR)|Dong Young Jang of Seongnam-si (KR)]][[Category:Dong Young Jang of Seongnam-si (KR)]]

[[:Category:Young Jo Jin of Hwaseong-si (KR)|Young Jo Jin of Hwaseong-si (KR)]][[Category:Young Jo Jin of Hwaseong-si (KR)]]

==SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18542665 titled 'SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD

'''Simplified Explanation:'''
The patent application describes a substrate treatment system and method that allows for precise etching adjustments and increases the Unit Per Equipment Hour (UPEH) by reducing process time.

'''Key Features and Innovation:'''
* Technology for fine etching adjustment
* Increased UPEH by reducing process time

'''Potential Applications:'''
The technology can be used in semiconductor manufacturing, electronics production, and other industries requiring precise substrate treatment.

'''Problems Solved:'''
The technology addresses the need for fine etching adjustments and efficiency improvements in substrate treatment processes.

'''Benefits:'''
* Enhanced precision in etching adjustments
* Increased productivity with reduced process time

'''Commercial Applications:'''
The technology can be applied in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions to improve substrate treatment processes and increase overall efficiency.

'''Prior Art:'''
Readers can explore prior patents related to substrate treatment systems and methods to understand the evolution of this technology.

'''Frequently Updated Research:'''
Stay informed about the latest advancements in substrate treatment systems and methods to ensure the most up-to-date information on this technology.

'''Questions about Substrate Treatment Systems:'''
1. What are the key advantages of using a substrate treatment system?
2. How does the technology in this patent application improve substrate treatment processes?


==Original Abstract Submitted==

Proposed are a substrate treatment system and a substrate treatment method. More particularly, a technology capable of realizing a fine etching adjustment and capable of increasing a Unit Per Equipment Hour (UPEH) by reducing time required for a process is provided.



[[Category:H01L21/67]]
[[Category:H01J37/32]]
[[Category:CPC_H01L21/67276]]