View source for 18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)

=INSULATION MODULE=


==Organization Name==

[[:Category:Rohm Co., Ltd.|Rohm Co., Ltd.]]


[[Category:Rohm Co., Ltd.]]

==Inventor(s)==

[[:Category:Masahiko Arimura of Kyoto-shi (JP)|Masahiko Arimura of Kyoto-shi (JP)]][[Category:Masahiko Arimura of Kyoto-shi (JP)]]

[[:Category:Tomoichiro Toyama of Kyoto-shi (JP)|Tomoichiro Toyama of Kyoto-shi (JP)]][[Category:Tomoichiro Toyama of Kyoto-shi (JP)]]

==INSULATION MODULE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18537324 titled 'INSULATION MODULE

==Simplified Explanation==

The insulation module described in the patent application includes a light-emitting element with a pad on its surface, a light-receiving element forming a photocoupler with the light-emitting element, a plate-shaped member between the light-emitting and light-receiving surfaces, and a wire connected to the pad. The pad is positioned off-center towards a section of the light-emitting surface where the distance to the plate-shaped member increases.

* Light-emitting element with pad on surface
* Light-receiving element forming a photocoupler
* Plate-shaped member with light-transmitting and insulating properties
* Wire connected to the pad

== Potential Applications ==
This technology could be used in:
* Optoelectronic devices
* Communication systems
* Sensor applications

== Problems Solved ==
This innovation addresses:
* Improved light transmission
* Enhanced insulation properties
* Efficient signal transfer

== Benefits ==
The benefits of this technology include:
* Increased efficiency in light transmission
* Enhanced signal reliability
* Improved insulation properties

== Potential Commercial Applications ==
This technology could be applied in:
* LED lighting systems
* Fiber optic communication devices
* Industrial automation equipment

== Possible Prior Art ==
One possible prior art for this technology could be the use of similar insulation modules in optoelectronic devices or communication systems.

== Unanswered Questions ==

=== How does the inclination of the plate-shaped member impact the performance of the insulation module? ===
The angle of inclination of the plate-shaped member could affect the efficiency of light transmission and signal transfer within the module.

=== What materials are commonly used for the plate-shaped member in similar insulation modules? ===
The choice of materials for the plate-shaped member could influence the overall performance and durability of the insulation module.


==Original Abstract Submitted==

This insulation module comprises: a light-emitting element that has a light-emitting surface and a pad formed on the light-emitting surface; a light-receiving element that has a light-receiving surface facing the light-emitting surface with a space therebetween, and that constitutes a photocoupler together with the light-emitting element; a plate-shaped member that is provided between the light-emitting surface and the light-receiving surface, has light-transmitting and insulating properties, and is inclined with respect to both the light-emitting surface and the light-receiving surface; and a wire that is connected to the pad. The pad is disposed offset from the center toward a section among the light-emitting surface where the distance to the plate-shaped member increases.



[[Category:H01L25/16]]
[[Category:H01L23/00]]
[[Category:H01L23/495]]