View source for 18530646. BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS simplified abstract (THE BOEING COMPANY)

=BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS=


==Organization Name==

[[:Category:THE BOEING COMPANY|THE BOEING COMPANY]]


[[Category:THE BOEING COMPANY]]

==Inventor(s)==

[[:Category:George E. Bible of Chesterfield MO (US)|George E. Bible of Chesterfield MO (US)]][[Category:George E. Bible of Chesterfield MO (US)]]

[[:Category:Peter M. Winzek of Clayton MO (US)|Peter M. Winzek of Clayton MO (US)]][[Category:Peter M. Winzek of Clayton MO (US)]]

==BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18530646 titled 'BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS

'''Simplified Explanation''': 

The method involves creating a cutter relief groove in a bond assembly jig (BAJ), filling it with a material, and curing the material.

* Forming a cutter relief groove in the BAJ
* Filling the groove with a material
* Curing the material after filling

'''Key Features and Innovation''':

* Innovative method for preparing a bond assembly jig
* Utilizes a cutter relief groove to enhance the assembly process
* Incorporates a curing step to solidify the material in the groove

'''Potential Applications''':

This technology can be applied in industries that require precise bonding processes, such as electronics manufacturing and automotive assembly.

'''Problems Solved''':

* Improves the efficiency and accuracy of bond assembly processes
* Enhances the stability and durability of bonded components

'''Benefits''':

* Streamlines the assembly process
* Ensures strong and reliable bonds
* Reduces the risk of errors and defects

'''Commercial Applications''':

Potential commercial applications include the production of electronic devices, medical equipment, and aerospace components.

'''Prior Art''''':

Readers can explore prior art related to bond assembly jigs, cutter relief grooves, and material curing processes in the field of manufacturing and engineering.

'''Frequently Updated Research''':

Stay updated on advancements in bond assembly techniques, materials science, and industrial automation to further enhance the efficiency and effectiveness of this technology.

'''Questions about Bond Assembly Jigs''':

1. What are the different types of materials that can be used to fill the cutter relief groove in a bond assembly jig?
2. How does the curing process impact the strength and durability of the bond assembly?


==Original Abstract Submitted==

A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.



[[Category:B29C70/54]]
[[Category:CPC_B29C70/545]]