View source for 18529365. MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Yunseok Yang of Suwon-si (KR)|Yunseok Yang of Suwon-si (KR)]][[Category:Yunseok Yang of Suwon-si (KR)]]

[[:Category:Seula Ryu of Suwon-si (KR)|Seula Ryu of Suwon-si (KR)]][[Category:Seula Ryu of Suwon-si (KR)]]

[[:Category:Jaewoo Shin of Suwon-si (KR)|Jaewoo Shin of Suwon-si (KR)]][[Category:Jaewoo Shin of Suwon-si (KR)]]

[[:Category:Minhwan An of Suwon-si (KR)|Minhwan An of Suwon-si (KR)]][[Category:Minhwan An of Suwon-si (KR)]]

[[:Category:Seongjin Lee of Suwon-si (KR)|Seongjin Lee of Suwon-si (KR)]][[Category:Seongjin Lee of Suwon-si (KR)]]

[[:Category:Sunghak Lee of Suwon-si (KR)|Sunghak Lee of Suwon-si (KR)]][[Category:Sunghak Lee of Suwon-si (KR)]]

[[:Category:Eungchang Lee of Suwon-si (KR)|Eungchang Lee of Suwon-si (KR)]][[Category:Eungchang Lee of Suwon-si (KR)]]

[[:Category:Yunkyeong Jeong of Suwon-si (KR)|Yunkyeong Jeong of Suwon-si (KR)]][[Category:Yunkyeong Jeong of Suwon-si (KR)]]

[[:Category:Jinsuk Chung of Suwon-si (KR)|Jinsuk Chung of Suwon-si (KR)]][[Category:Jinsuk Chung of Suwon-si (KR)]]

==MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18529365 titled 'MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES

'''Simplified Explanation:'''
The patent application describes a memory device with multiple physical interfaces, including a buffer die and a memory die stack. The buffer die has two interface circuits to communicate with an external device, while the memory die stack consists of multiple stacked memory dies connected to these interface circuits. The selection signals from an external memory controller activate the respective interface circuits.

* The memory device includes a buffer die with two interface circuits and a memory die stack.
* The memory dies in the stack are connected to the interface circuits for communication.
* Selection signals from an external memory controller activate the interface circuits.

'''Key Features and Innovation:'''
* Memory device with multiple physical interfaces.
* Buffer die with two interface circuits.
* Memory die stack with stacked memory dies.
* External memory controller provides selection signals to activate interface circuits.

'''Potential Applications:'''
The technology can be used in various memory devices, data storage systems, and computing applications.

'''Problems Solved:'''
* Efficient communication between memory device and external controller.
* Improved data transfer speeds and reliability.
* Enhanced memory management capabilities.

'''Benefits:'''
* Faster data transfer rates.
* Enhanced memory performance.
* Improved system reliability and efficiency.

'''Commercial Applications:'''
The technology can be applied in data centers, servers, high-performance computing systems, and other memory-intensive applications.

'''Prior Art:'''
Research related to memory device interfaces, memory die stacking, and memory controller communication protocols can provide insights into prior art.

'''Frequently Updated Research:'''
Stay updated on advancements in memory device technology, interface design, and memory management systems for potential improvements in the technology.

'''Questions about Memory Device Interfaces:'''
1. How does the selection signal from the memory controller impact the activation of the interface circuits?
2. What are the potential challenges in integrating multiple physical interfaces in a memory device?


==Original Abstract Submitted==

A memory device and a system includes a plurality of physical interfaces. The memory device includes a buffer die including a first interface circuit and a second interface circuit configured to communicate with an external device and a memory die stack mounted on the buffer die and including a plurality of stacked memory dies. The plurality of memory dies are electrically connected to the first interface circuit and the second interface circuit, the first interface circuit is configured to activate responsive to a first selection signal, and the second interface circuit is configured to activate responsive to a second selection signal. The first selection signal and the second selection signal are received from a memory controller external to the memory device.



[[Category:H10B80/00]]
[[Category:H01L25/065]]
[[Category:H01L25/18]]
[[Category:CPC_H10B80/00]]