View source for 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)

=SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS=


==Organization Name==

[[:Category:Lodestar Licensing Group LLC|Lodestar Licensing Group LLC]]


[[Category:Lodestar Licensing Group LLC]]

==Inventor(s)==

[[:Category:Thomas H. Kinsley of Boise ID (US)|Thomas H. Kinsley of Boise ID (US)]][[Category:Thomas H. Kinsley of Boise ID (US)]]

[[:Category:George E. Pax of Boise ID (US)|George E. Pax of Boise ID (US)]][[Category:George E. Pax of Boise ID (US)]]

==SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18526964 titled 'SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS

==Simplified Explanation==

The abstract describes a semiconductor device with pass-through clock traces, including a package substrate, first and second semiconductor dies, and electrical connectors.

* The semiconductor device includes a package substrate with substrate contacts, a first semiconductor die attached to the substrate, and a second semiconductor die stacked on top.
* The first semiconductor die has a first conductive contact on its upper surface, while the second semiconductor die has a second conductive contact.
* Electrical connectors link the substrate contacts to the conductive contacts on both dies.

== Potential Applications ==
This technology could be applied in high-performance computing, telecommunications, and consumer electronics where efficient clock signal distribution is crucial.

== Problems Solved ==
This innovation solves the challenge of distributing clock signals efficiently within a semiconductor package, reducing signal interference and improving overall system performance.

== Benefits ==
The use of pass-through clock traces in semiconductor packages can lead to faster data processing, lower power consumption, and improved reliability in electronic devices.

== Potential Commercial Applications ==
"Pass-Through Clock Traces in Semiconductor Packages: Enhancing Signal Distribution Efficiency"

== Possible Prior Art ==
There may be prior art related to clock signal distribution techniques in semiconductor packages, but specific examples are not provided in this abstract.

=== Unanswered Questions ===

== How does this technology impact the overall size of the semiconductor device? ==
The abstract does not mention how the addition of pass-through clock traces affects the size or form factor of the semiconductor device.

== What are the potential limitations or drawbacks of using pass-through clock traces in semiconductor packages? ==
The abstract does not address any potential limitations or drawbacks that may arise from implementing this technology.


==Original Abstract Submitted==

Semiconductor packages with pass-through clock traces and associated devices, systems, and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate including a first surface having a plurality of substrate contacts, a first semiconductor die having a lower surface attached to the first surface of the package substrate, and a second semiconductor die stacked on top of the first semiconductor die. The first semiconductor die includes an upper surface including a first conductive contact, and the second semiconductor die includes a second conductive contact. A first electrical connector electrically couples a first one of the plurality of substrate contacts to the first and second conductive contacts, and a second electrical connector electrically couples a second one of the plurality of substrate contacts to the first and second conductive contacts.



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