View source for 18526588. TREATMENT LIQUID, CLEANING METHOD OF SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT simplified abstract (FUJIFILM CORPORATION)

=TREATMENT LIQUID, CLEANING METHOD OF SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT=


==Organization Name==

[[:Category:FUJIFILM CORPORATION|FUJIFILM CORPORATION]]


[[Category:FUJIFILM CORPORATION]]

==Inventor(s)==

[[:Category:Nobuaki Sugimura of Haibara-gun (JP)|Nobuaki Sugimura of Haibara-gun (JP)]][[Category:Nobuaki Sugimura of Haibara-gun (JP)]]

[[:Category:Tetsuya Kamimura of Haibara-gun (JP)|Tetsuya Kamimura of Haibara-gun (JP)]][[Category:Tetsuya Kamimura of Haibara-gun (JP)]]

==TREATMENT LIQUID, CLEANING METHOD OF SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18526588 titled 'TREATMENT LIQUID, CLEANING METHOD OF SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

==Simplified Explanation==

The treatment liquid described in the patent application contains specific compounds such as quaternary ammonium compounds, quaternary phosphonium compounds, sulfur-containing compounds, and solvents. 

* The treatment liquid has excellent removability of a hydrophobic anticorrosion agent.
* The treatment liquid has excellent suppression property of copper surface roughness.

== Potential Applications ==
The technology described in the patent application could be applied in the semiconductor industry for cleaning semiconductor substrates and manufacturing semiconductor elements.

== Problems Solved ==
1. The treatment liquid solves the problem of effectively removing hydrophobic anticorrosion agents.
2. The treatment liquid addresses the issue of suppressing copper surface roughness during semiconductor manufacturing processes.

== Benefits ==
1. Improved cleaning efficiency for semiconductor substrates.
2. Enhanced surface quality of copper in semiconductor elements.
3. Increased reliability and performance of semiconductor devices.

== Potential Commercial Applications ==
Optimizing Semiconductor Manufacturing Processes with Innovative Treatment Liquid

== Possible Prior Art ==
There is prior art related to the use of various cleaning solutions in the semiconductor industry to remove contaminants and improve surface quality. However, the specific combination of compounds in the treatment liquid described in this patent application may be novel and innovative.

== Unanswered Questions ==

=== How does the treatment liquid impact the overall cost of semiconductor manufacturing processes? ===
The patent application does not provide information on the cost implications of using the treatment liquid compared to existing cleaning methods.

=== What are the environmental implications of using the treatment liquid in semiconductor manufacturing? ===
The environmental impact of the treatment liquid, such as its biodegradability and potential hazards, is not addressed in the patent application.


==Original Abstract Submitted==

An object of the present invention is to provide a treatment liquid having excellent removability of a hydrophobic anticorrosion agent and excellent suppression property of copper surface roughness, a cleaning method of a semiconductor substrate, and a manufacturing method of a semiconductor element. The treatment liquid of the present invention contains at least one specific compound selected from the group consisting of a quaternary ammonium compound including a quaternary ammonium cation having a total number of carbon atoms of 5 or more and a quaternary phosphonium compound including a quaternary phosphonium cation having a total number of carbon atoms of 5 or more, a sulfur-containing compound, and a solvent.



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