View source for 18523474. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SCREEN Holdings Co., Ltd.)

=SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD=


==Organization Name==

[[:Category:SCREEN Holdings Co., Ltd.|SCREEN Holdings Co., Ltd.]]


[[Category:SCREEN Holdings Co., Ltd.]]

==Inventor(s)==

[[:Category:Shuichi Yasuda of Kyoto (JP)|Shuichi Yasuda of Kyoto (JP)]][[Category:Shuichi Yasuda of Kyoto (JP)]]

[[:Category:Kenji Kobayashi of Kyoto (JP)|Kenji Kobayashi of Kyoto (JP)]][[Category:Kenji Kobayashi of Kyoto (JP)]]

==SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18523474 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

==Simplified Explanation==

The patent application describes a system for controlling the dissolved concentration of gas in a processing liquid by measuring the concentrations in two supply liquids, mixing them, and adjusting the flow rates based on the measured values.

* The system includes first and second concentration measurement parts in supply liquid lines, with one end of each connected to the upstream side of the concentration measurement parts and the other end connected to a mixing part.
* By controlling the flow rate adjustment parts of the branch lines based on the measured values, the system ensures the dissolved gas concentration in the processing liquid reaches a set value with high accuracy.

== Potential Applications ==
This technology could be applied in industries where precise control of gas concentrations in processing liquids is crucial, such as semiconductor manufacturing, pharmaceutical production, and water treatment.

== Problems Solved ==
This system solves the problem of contamination in the processing liquid caused by particles from the concentration measurement parts, ensuring a clean supply to the substrate. It also addresses the challenge of accurately adjusting the dissolved gas concentration in the processing liquid.

== Benefits ==
The system allows for precise control of gas concentrations in processing liquids, leading to improved product quality and process efficiency. It also reduces the risk of contamination and ensures consistent performance.

== Potential Commercial Applications ==
Potential commercial applications for this technology include equipment manufacturers for semiconductor fabrication, pharmaceutical companies, and water treatment facilities. The technology could also be integrated into existing systems for improved gas concentration control.

== Possible Prior Art ==
One possible prior art for this technology could be systems that control gas concentrations in liquids using sensors and feedback mechanisms. However, the specific approach of measuring concentrations in two supply liquids, mixing them, and adjusting flow rates based on the measurements may be a novel aspect of this patent application.

== Unanswered Questions ==

=== How does the system handle variations in gas concentrations in the supply liquids over time? ===
The patent application does not provide details on how the system compensates for fluctuations in gas concentrations in the supply liquids, which could impact the accuracy of the dissolved gas concentration in the processing liquid.

=== What is the cost-effectiveness of implementing this system compared to existing gas concentration control methods? ===
The patent application does not discuss the cost implications of installing and operating this system, including any potential savings or efficiency gains compared to alternative technologies.


==Original Abstract Submitted==

First and second concentration measurement parts () are provided in first and second supply liquid lines () in which first and second supply liquids flow, respectively. A dissolved concentration of gas in the second supply liquid is lower than that in the first supply liquid. In the first and second supply liquid lines, respective one ends of first and second branch lines () are connected to respective positions on the upstream side of the concentration measurement parts. The other ends of the first and second branch lines are connected to a mixing part (), and by mixing the first and second supply liquids, a processing liquid is generated. Respective flow rate adjustment parts () of the first and second branch lines are controlled on the basis of respective measured values of the first and second concentration measurement parts so that the dissolved concentration of the gas in the processing liquid can become a set value. It is thereby possible to prevent the supply liquid containing particles or the like caused by the concentration measurement part from being contained into the processing liquid to be supplied to a substrate and also to adjust the dissolved concentration of the gas in the processing liquid to the set value with high accuracy.



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