View source for 18522152. LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING LOAD LOCK ARRANGEMENTS, AND METHODS OF MAKING LOAD LOCKS FOR SEMICONDUCTOR PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)

=LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING LOAD LOCK ARRANGEMENTS, AND METHODS OF MAKING LOAD LOCKS FOR SEMICONDUCTOR PROCESSING SYSTEMS=


==Organization Name==

[[:Category:ASM IP Holding B.V.|ASM IP Holding B.V.]]


[[Category:ASM IP Holding B.V.]]

==Inventor(s)==

[[:Category:Senthil Sivaraman of Phoenix AZ (US)|Senthil Sivaraman of Phoenix AZ (US)]][[Category:Senthil Sivaraman of Phoenix AZ (US)]]

[[:Category:Mandar Deshpande of Phoenix AZ (US)|Mandar Deshpande of Phoenix AZ (US)]][[Category:Mandar Deshpande of Phoenix AZ (US)]]

[[:Category:Samer Banna of Phoenix AZ (US)|Samer Banna of Phoenix AZ (US)]][[Category:Samer Banna of Phoenix AZ (US)]]

==LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING LOAD LOCK ARRANGEMENTS, AND METHODS OF MAKING LOAD LOCKS FOR SEMICONDUCTOR PROCESSING SYSTEMS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18522152 titled 'LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING LOAD LOCK ARRANGEMENTS, AND METHODS OF MAKING LOAD LOCKS FOR SEMICONDUCTOR PROCESSING SYSTEMS

==Simplified Explanation==

The load lock arrangement described in the patent application includes a load lock body with upper, intermediate, and lower plate members defining different accessory seats for various components such as heaters, chill plates, and blanking plates. 

* Upper plate member defines upper accessory seat
* Intermediate plate member defines intermediate accessory seat
* Lower plate member defines lower accessory seat
* Components such as heaters, chill plates, and blanking plates are fixed to corresponding accessory seats
* Semiconductor processing systems, methods of making load lock arrangements, and material layer deposition methods are also described

== Potential Applications ==
The technology described in the patent application could be applied in semiconductor manufacturing processes, specifically in load lock arrangements for material layer deposition.

== Problems Solved ==
This technology solves the problem of efficiently and effectively transferring materials in and out of a vacuum chamber during semiconductor processing.

== Benefits ==
The benefits of this technology include improved process efficiency, reduced contamination risks, and enhanced control over material layer deposition processes.

== Potential Commercial Applications ==
The potential commercial applications of this technology could be in the semiconductor equipment manufacturing industry, where companies could incorporate these load lock arrangements into their processing systems.

== Possible Prior Art ==
One possible prior art for this technology could be existing load lock arrangements used in semiconductor processing systems. These prior art systems may not have the same configuration or features as the one described in the patent application.

=== Unanswered Questions ===

== How does this technology compare to existing load lock arrangements in terms of efficiency and reliability? ==
The article does not provide a direct comparison between this technology and existing load lock arrangements in terms of efficiency and reliability. 

== What are the specific semiconductor processing systems that could benefit most from this technology? ==
The article does not specify the specific semiconductor processing systems that could benefit most from this technology.


==Original Abstract Submitted==

A load lock arrangement includes a load lock body having an upper plate member defining an upper accessory seat, an intermediate plate member spaced apart from the upper plate member and defining an intermediate accessory seat, and a lower plate member separated from the upper plate member by the intermediate plate member and defining a lower accessory seat. One of an upper heater and an upper accessory seat blanking plate is fixed to the upper accessory seat; one of an upper chill plate and an intermediate accessory seat blanking plate fixed to the intermediate accessory seat; and one of a lower chill plate, a lower heater, and a lower accessory seat blanking plate fixed to the lower accessory seat. Semiconductor processing systems, methods of making load lock arrangements, and material layer deposition methods are also described.



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