View source for 18521375. INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Chien-Ying Chen of Hsinchu (TW)|Chien-Ying Chen of Hsinchu (TW)]][[Category:Chien-Ying Chen of Hsinchu (TW)]]

[[:Category:Yao-Jen Yang of Hsinchu (TW)|Yao-Jen Yang of Hsinchu (TW)]][[Category:Yao-Jen Yang of Hsinchu (TW)]]

==INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18521375 titled 'INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINE, METHOD OF FABRICATING THE SAME, AND LAYOUT METHOD

==Simplified Explanation==

The method described in the abstract involves generating an integrated circuit layout diagram by overlapping various regions within the circuit.

* Overlapping an active region with gate regions to define a program transistor and a read transistor of a one-time-programmable (OTP) bit.
* Overlapping a through via region with a gate region or active region, and then overlapping the through via region with a metal region of a back-side metal layer.

== Potential Applications ==
This technology could be applied in the semiconductor industry for the development of advanced integrated circuits with improved performance and functionality.

== Problems Solved ==
This method solves the problem of efficiently designing and fabricating integrated circuits with complex layouts and multiple functionalities.

== Benefits ==
The benefits of this technology include enhanced circuit performance, increased functionality, and improved reliability of integrated circuits.

== Potential Commercial Applications ==
The potential commercial applications of this technology include the production of high-performance electronic devices, such as smartphones, tablets, and computers.

== Possible Prior Art ==
One possible prior art for this technology could be the use of similar methods in the design and fabrication of integrated circuits in the semiconductor industry.

== Unanswered Questions ==
=== How does this method compare to existing techniques for generating IC layout diagrams? ===
This article does not provide a direct comparison to existing techniques, leaving the reader to wonder about the specific advantages of this method over others.

=== What are the specific limitations or challenges of implementing this technology in practical applications? ===
The article does not address any potential limitations or challenges that may arise when implementing this technology, leaving room for further exploration and analysis.


==Original Abstract Submitted==

A method of generating an integrated circuit (IC) layout diagram includes overlapping an active region with a plurality of gate regions, thereby defining a program transistor and a read transistor of a one-time-programmable (OTP) bit, overlapping a through via region with a gate region of the plurality of gate regions or with the active region, and overlapping the through via region with a metal region of a back-side metal layer.



[[Category:H10B20/20]]
[[Category:G06F30/392]]