View source for 18516825. DETERMINATION METHOD, EXPOSURE METHOD, METHOD OF MANUFACTURING ARTICLE, INFORMATION PROCESSING APPARATUS, AND EXPOSURE APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)

=DETERMINATION METHOD, EXPOSURE METHOD, METHOD OF MANUFACTURING ARTICLE, INFORMATION PROCESSING APPARATUS, AND EXPOSURE APPARATUS=


==Organization Name==

[[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]


[[Category:CANON KABUSHIKI KAISHA]]

==Inventor(s)==

[[:Category:ATSUSHI Takagi of Tochigi (JP)|ATSUSHI Takagi of Tochigi (JP)]][[Category:ATSUSHI Takagi of Tochigi (JP)]]

==DETERMINATION METHOD, EXPOSURE METHOD, METHOD OF MANUFACTURING ARTICLE, INFORMATION PROCESSING APPARATUS, AND EXPOSURE APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18516825 titled 'DETERMINATION METHOD, EXPOSURE METHOD, METHOD OF MANUFACTURING ARTICLE, INFORMATION PROCESSING APPARATUS, AND EXPOSURE APPARATUS

==Simplified Explanation==

The present disclosure describes a method for determining a driving profile of a substrate in scanning exposure for transferring a pattern image from an original to a shot region on the substrate. This involves obtaining information about distortion in an underlying pattern on the shot region, calculating a driving profile for each position in a non-scanning direction, and generating the final driving profile for the substrate.

* Obtaining information about distortion in the underlying pattern on the shot region
* Calculating a driving profile for each position in a non-scanning direction
* Generating the final driving profile for the substrate

== Potential Applications ==
This technology could be applied in semiconductor manufacturing, photolithography processes, and other industries where precise pattern transfer is required.

== Problems Solved ==
This technology helps to address issues related to overlay accuracy and distortion in pattern transfer processes, leading to improved quality and efficiency in manufacturing.

== Benefits ==
The benefits of this technology include enhanced accuracy in pattern transfer, increased productivity, and improved overall quality of manufactured products.

== Potential Commercial Applications ==
Potential commercial applications of this technology include semiconductor fabrication facilities, photolithography equipment manufacturers, and companies involved in high-precision manufacturing processes.

== Possible Prior Art ==
One possible prior art in this field is the use of alignment marks and feedback control systems to improve overlay accuracy in pattern transfer processes.

=== Unanswered Questions ===

=== How does this method compare to existing techniques for determining driving profiles in scanning exposure processes? ===
This article does not provide a direct comparison with existing techniques, leaving the reader to wonder about the specific advantages or limitations of this new method.

=== What are the specific parameters or variables used in the calculation of the driving profiles for the substrate? ===
The article does not delve into the specific parameters or variables used in the calculation process, leaving room for further exploration into the technical details of the method.


==Original Abstract Submitted==

The present disclosure provides a determination method of determining a first driving profile of a substrate in scanning exposure of transferring a pattern image of an original to a shot region on the substrate by scan-driving the substrate with respect to slit-shaped light, including obtaining information representing a distortion in an underlaying pattern on the shot region, calculating, for each of a plurality of positions in a non-scanning direction intersecting a scanning direction of the substrate, based on the information obtained in the obtaining, a second driving profile of the substrate for overlaying the pattern image of the original on the underlaying pattern in the scanning exposure, and generating the first driving profile from the second driving profiles each calculated in the calculating for each of the plurality of positions in the non-scanning direction.



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