View source for 18510822. PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)

=PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD=


==Organization Name==

[[:Category:SUMITOMO ELECTRIC INDUSTRIES, LTD.|SUMITOMO ELECTRIC INDUSTRIES, LTD.]]


[[Category:SUMITOMO ELECTRIC INDUSTRIES, LTD.]]

==Inventor(s)==

[[:Category:Hiroshi Ueda of Osaka (JP)|Hiroshi Ueda of Osaka (JP)]][[Category:Hiroshi Ueda of Osaka (JP)]]

[[:Category:Ippei Tanaka of Osaka (JP)|Ippei Tanaka of Osaka (JP)]][[Category:Ippei Tanaka of Osaka (JP)]]

[[:Category:Takashi Kasuga of Osaka (JP)|Takashi Kasuga of Osaka (JP)]][[Category:Takashi Kasuga of Osaka (JP)]]

[[:Category:Masamichi Yamamoto of Osaka (JP)|Masamichi Yamamoto of Osaka (JP)]][[Category:Masamichi Yamamoto of Osaka (JP)]]

==PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18510822 titled 'PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

==Simplified Explanation==

The patent application describes a printed circuit board with an insulating base film and wiring portions foamed on the surface of the base film. The wiring portions consist of a seed layer and a metal layer, with specific requirements for the outermost boundary wiring portion in terms of thickness and width.

* Insulating base film with wiring portions foamed on the surface
* Wiring portions include seed layer and metal layer
* Outermost boundary wiring portion has specific thickness and width requirements

== Potential Applications ==
The technology described in this patent application could be used in various electronic devices and systems that require printed circuit boards, such as smartphones, computers, and automotive electronics.

== Problems Solved ==
This technology solves the problem of ensuring proper wiring connections on a printed circuit board while maintaining specific thickness and width requirements for the outermost boundary wiring portion.

== Benefits ==
The benefits of this technology include improved reliability and performance of electronic devices due to the precise construction of the wiring portions on the printed circuit board.

== Potential Commercial Applications ==
* "Advanced Printed Circuit Board Technology for Enhanced Electronic Devices"

== Possible Prior Art ==
One possible prior art for this technology could be traditional printed circuit boards with wiring portions that do not meet the specific thickness and width requirements outlined in this patent application.

=== Unanswered Questions ===

=== How does this technology compare to existing printed circuit board designs in terms of cost-effectiveness and manufacturing efficiency? ===
This article does not provide information on the cost-effectiveness and manufacturing efficiency of this technology compared to existing printed circuit board designs.

=== What are the environmental implications of using this technology in electronic devices? ===
The article does not address the environmental implications of implementing this technology in electronic devices, such as potential recycling challenges or material sustainability concerns.


==Original Abstract Submitted==

A printed circuit board includes: an insulating base film; and a plurality of wiring portions foamed on a surface of the base film. The wiring portions include a seed layer directly or indirectly layered on the surface of the base film and a metal layer layered on the seed layer. The base film has a wiring area including the plurality of wiring portions and a non-wiring area not including the wiring portions. The plurality of wiring portions include at least one outermost boundary wiring portion and a plurality of inner wiring portions. The outermost boundary wiring portion is formed on an outermost-side of the base film in the wiring area and at a boundary between the wiring area and the non-wiring area. An average thickness of the outermost boundary wiring portion is 40μm or more. An average width of the outermost boundary wiring portion is 30 μm or more.



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