View source for 18506538. Electronic Device simplified abstract (SEIKO EPSON CORPORATION)

=Electronic Device=


==Organization Name==

[[:Category:SEIKO EPSON CORPORATION|SEIKO EPSON CORPORATION]]


[[Category:SEIKO EPSON CORPORATION]]

==Inventor(s)==

[[:Category:Hitoshi Ueno of Shiojiri (JP)|Hitoshi Ueno of Shiojiri (JP)]][[Category:Hitoshi Ueno of Shiojiri (JP)]]

==Electronic Device - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18506538 titled 'Electronic Device

==Simplified Explanation==

The patent application describes an electronic device with a lead structure that is joined to the substrate via a conductive joint member. The lead includes a base end portion, a distal end portion, and a coupling portion, with specific angles and distances between components.

* The lead structure of the electronic device is designed to optimize the connection between the electronic component and the substrate.
* The angle and distance measurements of the lead components ensure proper alignment and connection within the device.

== Potential Applications ==
The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.

== Problems Solved ==
This technology solves the problem of ensuring a secure and reliable connection between electronic components and the substrate in electronic devices.

== Benefits ==
The benefits of this technology include improved performance, reliability, and durability of electronic devices due to the optimized lead structure design.

== Potential Commercial Applications ==
The optimized lead structure design could be attractive to manufacturers of electronic devices looking to improve the quality and performance of their products.

== Possible Prior Art ==
There may be prior art related to lead structures in electronic devices, but specific details would need to be researched to determine any existing patents or technologies.

=== Unanswered Questions ===

=== How does this technology compare to existing lead structures in electronic devices? ===
The article does not provide a direct comparison between this technology and existing lead structures in electronic devices. Further research and analysis would be needed to determine the specific advantages and differences.

=== What specific electronic components or devices could benefit most from this technology? ===
The article does not specify which electronic components or devices could benefit most from this technology. A more detailed analysis of potential applications would be necessary to answer this question accurately.


==Original Abstract Submitted==

An electronic device includes a substrate having a first surface and a second surface in a front-back relation, a first electronic component mounted on the second surface, and a lead joined to the second surface of the substrate via a conductive joint member, wherein the lead includes a base end portion extending in a direction along the substrate and joined to the second surface via the joint member, a distal end portion located distally from the substrate with respect to the base end portion in a thickness direction of the substrate and having a terminal surface, and a coupling portion coupling the base end portion and the distal end portion, and θ, wherein, as seen from a direction orthogonal to a plane along which the lead extends, an angle formed by a line connecting an outermost position in which the joint member contacts the base end portion and an outer edge of the substrate and the base end portion is θ, a distance between the first electronic component and the terminal surface in the thickness direction of the substrate is d, a distance between a boundary part between the base end portion and the coupling portion and the joint member in the direction along the substrate is d, and arctan(d/d)=θ



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