View source for 18505569. SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE simplified abstract (STMicroelectronics International N.V.)

=SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE=


==Organization Name==

[[:Category:STMicroelectronics International N.V.|STMicroelectronics International N.V.]]


[[Category:STMicroelectronics International N.V.]]

==Inventor(s)==

[[:Category:Gabriele Bellocchi of Catania (IT)|Gabriele Bellocchi of Catania (IT)]][[Category:Gabriele Bellocchi of Catania (IT)]]

[[:Category:Simone Rascuna' of Catania (IT)|Simone Rascuna' of Catania (IT)]][[Category:Simone Rascuna' of Catania (IT)]]

[[:Category:Valeria Puglisi of Catania (IT)|Valeria Puglisi of Catania (IT)]][[Category:Valeria Puglisi of Catania (IT)]]

==SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18505569 titled 'SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE

==Simplified Explanation==

The electronic device described in the patent application includes a solid body with a Silicon Carbide substrate, an electrical terminal on the substrate, a passivation layer on the electrical terminal, and a first adhesion improving layer coupled to the passivation layer and the solid body.

* Silicon Carbide substrate
* Electrical terminal on the substrate
* Passivation layer on the electrical terminal
* First adhesion improving layer coupled to the passivation layer and the solid body

== Potential Applications ==
The technology described in this patent application could be applied in the manufacturing of electronic devices, sensors, and semiconductor components.

== Problems Solved ==
This technology helps improve the adhesion between different layers in electronic devices, enhancing their performance and reliability.

== Benefits ==
The use of a first adhesion improving layer can increase the durability and longevity of electronic devices, leading to better overall performance.

== Potential Commercial Applications ==
* Advanced electronics manufacturing
* Semiconductor industry applications

== Possible Prior Art ==
There may be prior art related to the use of adhesion improving layers in electronic devices, but specific examples are not provided in this patent application.

== Unanswered Questions ==
=== How does the first adhesion improving layer impact the overall performance of the electronic device? ===
The patent application mentions the use of a first adhesion improving layer, but does not elaborate on how this layer specifically enhances the device's performance.

=== Are there any limitations to the materials that can be used for the first adhesion improving layer? ===
The patent application mentions a second material with predefined characteristics of adhesion, but it does not discuss any potential limitations or constraints in selecting this material.


==Original Abstract Submitted==

Electronic device, comprising: a solid body including a Silicon Carbide substrate, and further including an electrical terminal of the electronic device on the substrate; a passivation layer on the electrical terminal, of a first material; and a first adhesion improving layer coupled to the passivation layer and to the solid body, of a second material having predefined characteristics of adhesion to the first material, and configured to bond together the passivation layer and the solid body.



[[Category:H01L23/31]]
[[Category:H01L29/06]]
[[Category:H01L29/16]]
[[Category:H01L29/66]]
[[Category:H01L29/872]]