View source for 18503543. SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract (HYUNDAI MOBIS CO., LTD.)

=SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME=


==Organization Name==

[[:Category:HYUNDAI MOBIS CO., LTD.|HYUNDAI MOBIS CO., LTD.]]


[[Category:HYUNDAI MOBIS CO., LTD.]]

==Inventor(s)==

[[:Category:Yoon Ju Kim of Hwaseong-si (KR)|Yoon Ju Kim of Hwaseong-si (KR)]][[Category:Yoon Ju Kim of Hwaseong-si (KR)]]

[[:Category:Jeong Kwang Seo of Seongnam-si (KR)|Jeong Kwang Seo of Seongnam-si (KR)]][[Category:Jeong Kwang Seo of Seongnam-si (KR)]]

[[:Category:Yu Cheol Park of Anyang-si (KR)|Yu Cheol Park of Anyang-si (KR)]][[Category:Yu Cheol Park of Anyang-si (KR)]]

[[:Category:Chan Yang Choe of Seoul (KR)|Chan Yang Choe of Seoul (KR)]][[Category:Chan Yang Choe of Seoul (KR)]]

==SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18503543 titled 'SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME

The abstract describes a single-sided cooling power module with a pattern on a direct bonded copper (DBC) substrate for conducting electricity, a power device chip, a power terminal, and a signal pin.

* The cooling power module includes a pattern on a DBC substrate for conducting electricity.
* A power device chip is placed on the DBC substrate and electrically connected to the pattern.
* A power terminal is coupled to the DBC substrate and electrically connected to the pattern.
* A signal pin extends perpendicularly to the DBC substrate's surface, facing the power device chip, and is electrically connected to the pattern.

Potential Applications:
- Power electronics
- Electric vehicles
- Renewable energy systems

Problems Solved:
- Efficient cooling of power modules
- Enhanced electrical conductivity
- Improved thermal management

Benefits:
- Increased power module performance
- Better heat dissipation
- Enhanced reliability and longevity

Commercial Applications:
Title: "Innovative Single-Sided Cooling Power Modules for Enhanced Performance"
This technology can be used in various industries such as automotive, aerospace, and renewable energy for improved power module efficiency and reliability.

Questions about the technology:
1. How does the single-sided cooling design improve the performance of power modules?
2. What are the key advantages of using a DBC substrate in this cooling power module design?


==Original Abstract Submitted==

Single-sided cooling power module and methods of manufacturing are disclosed where the cooling power module includes a pattern formed on a direct bonded copper (DBC) substrate to conduct electricity, a power device chip disposed on the DBC substrate and electrically connected to the pattern, a power terminal coupled to the DBC substrate and electrically connected to the pattern, and a signal pin extending in a direction perpendicular to a surface of the DBC substrate and facing the power device chip, the signal pin being electrically connected to the pattern.



[[Category:H01L23/31]]
[[Category:H01L23/00]]
[[Category:H01L23/498]]
[[Category:CPC_H01L23/3121]]