View source for 18495837. SENSOR ELECTRONIC DEVICE (TEXAS INSTRUMENTS INCORPORATED)

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=SENSOR ELECTRONIC DEVICE=


==Organization Name==

[[:Category:TEXAS INSTRUMENTS INCORPORATED|TEXAS INSTRUMENTS INCORPORATED]]


[[Category:TEXAS INSTRUMENTS INCORPORATED]]

==Inventor(s)==

[[:Category:Masamitsu Matsuura of BEPPU-SHI OITA-KEN JP|Masamitsu Matsuura of BEPPU-SHI OITA-KEN JP]][[Category:Masamitsu Matsuura of BEPPU-SHI OITA-KEN JP]]

[[:Category:Daiki Komatsu of BEPPU-SHI OITA-KEN JP|Daiki Komatsu of BEPPU-SHI OITA-KEN JP]][[Category:Daiki Komatsu of BEPPU-SHI OITA-KEN JP]]

[[:Category:Kengo Aoya of BEPPU-SHI OITA-KEN JP|Kengo Aoya of BEPPU-SHI OITA-KEN JP]][[Category:Kengo Aoya of BEPPU-SHI OITA-KEN JP]]

==SENSOR ELECTRONIC DEVICE==


This abstract first appeared for US patent application 18495837 titled 'SENSOR ELECTRONIC DEVICE

==Original Abstract Submitted==

An electronic device includes a package structure having opposite first and second sides, opposite third and fourth sides spaced along a first direction, opposite fifth and sixth sides spaced along an orthogonal second direction, the first and second sides spaced along a third direction orthogonal to the first and second directions, and an opening extending into the first side along the third direction, a first semiconductor die having a first side exposed in the opening of the package structure and an opposite second side partially enclosed by the package structure, and a second semiconductor die electrically connected to the first semiconductor die, the second semiconductor die enclosed by the package structure and laterally spaced apart from the first semiconductor die.



[[Category:H01L23/31]]
[[Category:H01L21/56]]
[[Category:H01L23/00]]
[[Category:CPC_H01L23/315]]