View source for 18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Joungeun Yoo of Seongnam-si (KR)|Joungeun Yoo of Seongnam-si (KR)]][[Category:Joungeun Yoo of Seongnam-si (KR)]]

[[:Category:Youngjae Kang of Suwon-si (KR)|Youngjae Kang of Suwon-si (KR)]][[Category:Youngjae Kang of Suwon-si (KR)]]

[[:Category:Duseop Yoon of Seongnam-si (KR)|Duseop Yoon of Seongnam-si (KR)]][[Category:Duseop Yoon of Seongnam-si (KR)]]

==WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18486574 titled 'WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING

==Simplified Explanation==

The abstract of the patent application describes a wiring material for a semiconductor device, which includes a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14. It also mentions a wiring for a semiconductor device and a semiconductor device itself that includes the wiring material.

* The patent application describes a wiring material for a semiconductor device.
* The wiring material contains a boride-based compound with boron and at least one metal from Groups 2 to 14.
* The patent application also includes a wiring for a semiconductor device that uses the same wiring material.
* Furthermore, a semiconductor device is described, which includes the wiring containing the wiring material.

Potential applications of this technology:
* This wiring material can be used in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
* It can be applied in electronic devices like smartphones, computers, and tablets.

Problems solved by this technology:
* The boride-based compound in the wiring material enhances the electrical conductivity and thermal stability of the wiring.
* The inclusion of boron and metals from Groups 2 to 14 improves the overall performance and reliability of the semiconductor device.

Benefits of this technology:
* The improved electrical conductivity allows for faster and more efficient data transfer within the semiconductor device.
* The enhanced thermal stability ensures that the wiring can withstand high temperatures without degradation.
* The overall performance and reliability of the semiconductor device are improved, leading to better functionality and longevity.


==Original Abstract Submitted==

Provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14, a wiring for a semiconductor device including the same, and a semiconductor device including the wiring containing the wiring material.



[[Category:H01L23/532]]
[[Category:C22C29/14]]