View source for 18484580. HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)

=HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER=


==Organization Name==

[[:Category:HUAWEI TECHNOLOGIES CO., LTD.|HUAWEI TECHNOLOGIES CO., LTD.]]


[[Category:HUAWEI TECHNOLOGIES CO., LTD.]]

==Inventor(s)==

[[:Category:Ming Cheng of Dongguan (CN)|Ming Cheng of Dongguan (CN)]][[Category:Ming Cheng of Dongguan (CN)]]

[[:Category:Buping Yuan of Dongguan (CN)|Buping Yuan of Dongguan (CN)]][[Category:Buping Yuan of Dongguan (CN)]]

[[:Category:Chengpeng Yang of Dongguan (CN)|Chengpeng Yang of Dongguan (CN)]][[Category:Chengpeng Yang of Dongguan (CN)]]

[[:Category:Yuping Hong of Dongguan (CN)|Yuping Hong of Dongguan (CN)]][[Category:Yuping Hong of Dongguan (CN)]]

[[:Category:Qinghe Zhang of Dongguan (CN)|Qinghe Zhang of Dongguan (CN)]][[Category:Qinghe Zhang of Dongguan (CN)]]

==HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18484580 titled 'HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER

==Simplified Explanation==

The patent application describes a heat conducting member that includes a substrate and a heat conducting layer. The substrate has a heat conducting surface, and the heat conducting layer includes a transition layer and a protective layer. The transition layer is placed on the heat conducting surface, while the protective layer is on a surface away from the heat conducting surface. The roughness of the protective layer is less than or equal to 0.4. The transition layer acts as a hardness transition function between the substrate and the protective layer, improving the overall hardness of the heat conducting member and preventing scratches.

* The heat conducting member consists of a substrate and a heat conducting layer.
* The substrate has a heat conducting surface.
* The heat conducting layer includes a transition layer and a protective layer.
* The transition layer is placed on the heat conducting surface.
* The protective layer is on a surface away from the heat conducting surface.
* The roughness (Ra) of the protective layer is less than or equal to 0.4.
* The transition layer provides a hardness transition function between the substrate and the protective layer.
* The protective layer ensures surface hardness and prevents scratches.

== Potential Applications ==
* Heat sinks for electronic devices
* Thermal management systems in automobiles
* Cooling systems for industrial machinery

== Problems Solved ==
* Prevents scratches on the heat conducting member's surface
* Improves overall hardness of the heat conducting member
* Provides effective heat transfer and dissipation

== Benefits ==
* Enhanced durability and protection against scratches
* Efficient heat conduction and dissipation
* Improved performance and reliability of heat conducting systems


==Original Abstract Submitted==

A heat conducting member is provided. The heat conducting member provided in this application includes a substrate and a heat conducting layer. The substrate includes a heat conducting surface. The heat conducting layer includes a transition layer and a protective layer. The transition layer is disposed on the heat conducting surface, and the protective layer is disposed on a surface that is of the transition layer and that is away from the heat conducting surface. Roughness Ra of the protective layer is less than or equal to 0.4. The transition layer can provide a hardness transition function between the substrate and the protective layer, to facilitate improving overall hardness of the heat conducting member. The protective layer may ensure surface hardness, to prevent an undesirable situation such as a scratch.



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