View source for 18483298. STACK PACKAGES simplified abstract (SK hynix Inc.)

=STACK PACKAGES=


==Organization Name==

[[:Category:SK hynix Inc.|SK hynix Inc.]]


[[Category:SK hynix Inc.]]

==Inventor(s)==

[[:Category:Eun Hye Do of Icheon-si Gyeonggi-do (KR)|Eun Hye Do of Icheon-si Gyeonggi-do (KR)]][[Category:Eun Hye Do of Icheon-si Gyeonggi-do (KR)]]

[[:Category:Chang Shik Jung of Icheon-si Gyeonggi-do (KR)|Chang Shik Jung of Icheon-si Gyeonggi-do (KR)]][[Category:Chang Shik Jung of Icheon-si Gyeonggi-do (KR)]]

==STACK PACKAGES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18483298 titled 'STACK PACKAGES

The abstract describes a stack package that includes a substrate with two bond fingers, and two semiconductor dies stacked on top of each other. Connectors are used to connect each semiconductor die to its respective bond finger.

* The stack package includes a substrate with two bond fingers spaced apart.
* Two semiconductor dies are stacked on top of each other within the package.
* Connectors are used to connect each semiconductor die to its corresponding bond finger.
* The second connector has the same length as the first connector.
* This technology enables efficient stacking of semiconductor dies in a compact package.

Potential Applications:
- This technology can be used in the manufacturing of integrated circuits.
- It can be applied in the development of advanced electronic devices.
- The stack package can be utilized in the production of high-performance computing systems.

Problems Solved:
- Enables efficient stacking of semiconductor dies.
- Provides a compact and reliable packaging solution for electronic components.

Benefits:
- Improved connectivity between semiconductor dies and bond fingers.
- Enhanced performance and reliability of electronic devices.
- Cost-effective packaging solution for integrated circuits.

Commercial Applications:
Title: Advanced Semiconductor Packaging Technology for Integrated Circuits
This technology can be commercialized in the semiconductor industry for the production of high-performance electronic devices. It can cater to the growing demand for compact and reliable packaging solutions in various applications.

Questions about Semiconductor Stack Package Technology:
1. How does the stack package technology improve the connectivity between semiconductor dies and bond fingers?
- The stack package technology utilizes connectors to establish a secure and efficient connection between semiconductor dies and bond fingers, ensuring reliable performance.

2. What are the potential applications of the stack package technology in the semiconductor industry?
- The stack package technology can be applied in the manufacturing of integrated circuits, advanced electronic devices, and high-performance computing systems.


==Original Abstract Submitted==

A stack package is provided. The stack package includes a package substrate on which a first bond finger and a second bond finger are spaced apart from each other, and a second semiconductor die stacked over a first semiconductor die. A first connector connects the first semiconductor die to the first bond finger. A second connector connects the second semiconductor die to the second bond finger and extends to have substantially the same length as the first connector.



[[Category:H01L25/065]]
[[Category:H01L23/00]]
[[Category:H10B80/00]]
[[Category:CPC_H01L25/0657]]