View source for 18477060. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)

=FILM FORMING APPARATUS AND FILM FORMING METHOD=


==Organization Name==

[[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]


[[Category:Tokyo Electron Limited]]

==Inventor(s)==

[[:Category:Yasunobu Suzuki of Yamanashi (JP)|Yasunobu Suzuki of Yamanashi (JP)]][[Category:Yasunobu Suzuki of Yamanashi (JP)]]

==FILM FORMING APPARATUS AND FILM FORMING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18477060 titled 'FILM FORMING APPARATUS AND FILM FORMING METHOD

==Simplified Explanation==

The film forming apparatus described in the patent application includes a processing chamber, a stage for holding the substrate, a film forming part, a movable shutter, and a film thickness measuring part.

* The processing chamber is where the film formation takes place.
* The stage holds the substrate during the film formation process.
* The film forming part is responsible for applying the film onto the substrate.
* The movable shutter can shield the substrate on the stage or retract to allow the film forming part to work on the substrate.
* The film thickness measuring part includes a device to measure the thickness of the film formed on the shutter.

== Potential Applications ==
The technology described in this patent application could be used in industries such as semiconductor manufacturing, display technology, and optical coatings.

== Problems Solved ==
This technology solves the problem of accurately measuring the film thickness during the film formation process, which is crucial for ensuring the quality and performance of the final product.

== Benefits ==
The benefits of this technology include improved control over the film formation process, enhanced product quality, and increased efficiency in manufacturing operations.

== Potential Commercial Applications ==
One potential commercial application of this technology could be in the production of high-quality optical coatings for lenses and mirrors used in various industries.

== Possible Prior Art ==
One possible prior art for this technology could be similar film forming apparatus used in semiconductor manufacturing or thin film deposition processes.

=== Unanswered Questions ===

=== How does the film thickness measuring device communicate the measurement data? ===
The patent application does not specify how the film thickness measuring device transmits the measurement data for analysis and control purposes.

=== What materials are suitable for the film forming part in this apparatus? ===
The patent application does not mention the specific materials that can be used for the film forming part, which could impact the performance and durability of the apparatus.


==Original Abstract Submitted==

A film forming apparatus for performing film formation on a substrate comprises a processing chamber, a stage configured to place thereon a substrate disposed in the processing chamber, a film forming part configured to perform film formation on the substrate placed on the stage, a shutter that is movable between a shielding position where the substrate on the stage is shielded and a retracted position retracted from the stage and where the film forming part performs the film formation on the substrate, and a film thickness measuring part. The film thickness measuring part has a film thickness measuring device configured to measure a film thickness of a film formed on the shutter at the shielding position by the film forming part.



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