View source for 18464969. Electronic Device with Folded Antenna Module (Apple Inc.)

=Electronic Device with Folded Antenna Module=


==Organization Name==

[[:Category:Apple Inc.|Apple Inc.]]


[[Category:Apple Inc.]]

==Inventor(s)==

[[:Category:Alden T Rush of San Diego CA (US)|Alden T Rush of San Diego CA (US)]][[Category:Alden T Rush of San Diego CA (US)]]

[[:Category:Salih Yarga of San Jose CA (US)|Salih Yarga of San Jose CA (US)]][[Category:Salih Yarga of San Jose CA (US)]]

[[:Category:Joel Ravi of San Francisco CA (US)|Joel Ravi of San Francisco CA (US)]][[Category:Joel Ravi of San Francisco CA (US)]]

[[:Category:Woonyong Bae of San Jose CA (US)|Woonyong Bae of San Jose CA (US)]][[Category:Woonyong Bae of San Jose CA (US)]]

[[:Category:Laura M Burke of Los Gatos CA (US)|Laura M Burke of Los Gatos CA (US)]][[Category:Laura M Burke of Los Gatos CA (US)]]

[[:Category:Bhaskara R Rupakula of San Jose CA (US)|Bhaskara R Rupakula of San Jose CA (US)]][[Category:Bhaskara R Rupakula of San Jose CA (US)]]

[[:Category:Haozhan Tian of San Jose CA (US)|Haozhan Tian of San Jose CA (US)]][[Category:Haozhan Tian of San Jose CA (US)]]

[[:Category:Erdinc Irci of Sunnyvale CA (US)|Erdinc Irci of Sunnyvale CA (US)]][[Category:Erdinc Irci of Sunnyvale CA (US)]]

[[:Category:Hongfei Hu of Cupertino CA (US)|Hongfei Hu of Cupertino CA (US)]][[Category:Hongfei Hu of Cupertino CA (US)]]

[[:Category:Carlo Di Nallo of Belmont CA (US)|Carlo Di Nallo of Belmont CA (US)]][[Category:Carlo Di Nallo of Belmont CA (US)]]

==Electronic Device with Folded Antenna Module==


This abstract first appeared for US patent application 18464969 titled 'Electronic Device with Folded Antenna Module

==Original Abstract Submitted==

An electronic device may be provided with a housing having sidewalls, a dielectric cover, and a conductive plate. A display may be mounted to the sidewalls opposite the dielectric cover. A logic board may be interposed between the display and the plate. The device may include a phased antenna array on a first module and an ultra-wideband (UWB) on a second module. The first and second modules may be surface-mounted to the main body of a flexible printed circuit between the plate and the dielectric cover. The UWB antenna and the array may convey radio-frequency signals through the dielectric cover. The flexible printed circuit may have a tail that carries the transmission lines for the UWB antenna and the array. The tail may be folded through a hole in the mid-chassis and coupled to a radio-frequency connector on the logic board.



[[Category:H01Q1/24]]
[[Category:H01Q3/36]]
[[Category:H01Q5/25]]
[[Category:CPC_H01Q1/243]]