View source for 18462010. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Hyunsu Hwang of Suwon-si (KR)|Hyunsu Hwang of Suwon-si (KR)]][[Category:Hyunsu Hwang of Suwon-si (KR)]]

[[:Category:Jumyong Park of Suwon-si (KR)|Jumyong Park of Suwon-si (KR)]][[Category:Jumyong Park of Suwon-si (KR)]]

[[:Category:Solji Song of Suwon-si (KR)|Solji Song of Suwon-si (KR)]][[Category:Solji Song of Suwon-si (KR)]]

[[:Category:Dongjoon Oh of Suwon-si (KR)|Dongjoon Oh of Suwon-si (KR)]][[Category:Dongjoon Oh of Suwon-si (KR)]]

[[:Category:Hyunchul Jung of Suwon-si (KR)|Hyunchul Jung of Suwon-si (KR)]][[Category:Hyunchul Jung of Suwon-si (KR)]]

[[:Category:Sanghoo Cho of Suwon-si (KR)|Sanghoo Cho of Suwon-si (KR)]][[Category:Sanghoo Cho of Suwon-si (KR)]]

==SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18462010 titled 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD

==Simplified Explanation==

A semiconductor device described in the patent application includes a substrate, front pads on the front surface of the substrate, and a circuit layer with an insulating layer and interconnections connected to the front pads. The circuit layer may be positioned between the front pads and the substrate, and may have a burr on the side surface that protrudes below the front surface or forms a step portion.

* The semiconductor device includes a substrate, front pads, and a circuit layer with interconnections.
* The circuit layer may have a burr on the side surface that protrudes below the front surface or forms a step portion.

== Potential Applications ==
The technology described in the patent application could be applied in various semiconductor devices, such as integrated circuits, sensors, and microprocessors.

== Problems Solved ==
This technology helps in improving the electrical connections and overall performance of semiconductor devices by providing a more efficient and reliable circuit layer design.

== Benefits ==
The benefits of this technology include enhanced electrical connectivity, improved signal transmission, and increased overall functionality of semiconductor devices.

== Potential Commercial Applications ==
The technology could find applications in the semiconductor industry for manufacturing advanced electronic devices with improved performance and reliability.

== Possible Prior Art ==
One possible prior art could be the use of different materials or designs for circuit layers in semiconductor devices to enhance their functionality and performance.

=== Unanswered Questions ===

=== How does the burr on the circuit layer affect the overall performance of the semiconductor device? ===
The burr on the circuit layer may impact the electrical connectivity and signal transmission within the device. Further research and testing are needed to determine the exact effects of the burr on the device's performance.

=== What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing processes? ===
One challenge could be ensuring uniformity and consistency in the fabrication of semiconductor devices with the circuit layer design described in the patent application. Manufacturers may need to develop specialized processes and equipment to overcome these challenges.


==Original Abstract Submitted==

A semiconductor device may include a substrate, one or more front pads disposed on a front surface of the substrate, and a circuit layer including an insulating layer and at least one interconnection electrically connected to the one or more front pads. In some embodiments, the circuit layer may be disposed between the one or more front pads and the substrate. In some embodiments, a side surface of the circuit layer may include a burr that protrudes a height that is below a level of a front surface of the circuit layer. Additionally or alternatively, the burr may form a step portion in the circuit layer.



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