View source for 18444152. SPEAKER simplified abstract (ALPS ALPINE CO., LTD.)

=SPEAKER=


==Organization Name==

[[:Category:ALPS ALPINE CO., LTD.|ALPS ALPINE CO., LTD.]]


[[Category:ALPS ALPINE CO., LTD.]]

==Inventor(s)==

[[:Category:Katsuhiko Egami of Iwaki (JP)|Katsuhiko Egami of Iwaki (JP)]][[Category:Katsuhiko Egami of Iwaki (JP)]]

==SPEAKER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18444152 titled 'SPEAKER

'''Simplified Explanation:'''
A through hole is created in the inner-side yoke of a magnetic circuit portion to allow circuit boards to be placed within it, aligned with the vibration direction of a vibration unit.

'''Key Features and Innovation:'''
* Through hole formed in inner-side yoke for circuit boards to pass through.
* Circuit boards aligned with the vibration direction of the vibration unit.
* Opening area in the middle space between circuit boards larger than side spaces.
* Improved airflow through the through hole for better cooling of heat-generating components.
* Suppression of air resistance during vibration of the vibration unit.

'''Potential Applications:'''
This technology can be applied in various electronic devices where heat-generating components require efficient cooling, such as in computers, servers, and industrial equipment.

'''Problems Solved:'''
This technology addresses the issues of inadequate cooling for heat-generating components mounted on circuit boards and the increase in air resistance during vibration, which can affect the performance and longevity of electronic devices.

'''Benefits:'''
* Enhanced cooling effects for heat-generating components.
* Reduced air resistance during vibration.
* Improved overall performance and reliability of electronic devices.

'''Commercial Applications:'''
The technology can be utilized in the design and manufacturing of electronic devices to ensure optimal cooling and performance, potentially leading to increased efficiency and longevity of the products in the market.

'''Prior Art:'''
Readers can explore prior art related to this technology in the field of electronic cooling systems, vibration damping mechanisms, and circuit board design for improved airflow.

'''Frequently Updated Research:'''
Researchers are constantly exploring advancements in electronic cooling technologies, vibration control methods, and circuit board layouts to enhance the efficiency and reliability of electronic devices.

'''Questions about the Technology:'''
1. How does the size of the opening area in the middle space affect the airflow through the through hole?
2. What are the specific challenges faced in designing circuit boards aligned with the vibration direction of the vibration unit?


==Original Abstract Submitted==

A through hole is formed in an inner-side yoke making up a magnetic circuit portion, passing therethrough following a vibration direction of a vibration unit, and circuit boards are disposed in the through hole. The circuit boards are disposed with board surfaces thereof following the vibration direction of the vibration unit. Also, an opening area of a middle space across which the circuit boards oppose each other is larger than opening areas of side spaces. Accordingly, flow quantity of air through the through hole can be obtained, increase in air resistance at the time of vibration of the vibration unit can be suppressed, and also wind velocity can be obtained, whereby cooling effects of heat-generating components mounted on the circuit boards can be improved.



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