View source for 18441422. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

=PRINTED CIRCUIT BOARD=


==Organization Name==

[[:Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.|SAMSUNG ELECTRO-MECHANICS CO., LTD.]]


[[Category:SAMSUNG ELECTRO-MECHANICS CO., LTD.]]

==Inventor(s)==

[[:Category:Jae Heun Lee of Suwon-si (KR)|Jae Heun Lee of Suwon-si (KR)]][[Category:Jae Heun Lee of Suwon-si (KR)]]

==PRINTED CIRCUIT BOARD==


This abstract first appeared for US patent application 18441422 titled 'PRINTED CIRCUIT BOARD




==Original Abstract Submitted==

A printed circuit board includes: a glass layer having a through-hole penetrating between an upper surface and a lower surface thereof; a through-via including a via metal layer disposed on a wall surface of the through-hole and a first insulating material disposed in at least a portion of a space between portions of the via metal layer in the through-hole; a first wiring layer disposed on the upper surface of the glass layer, at least a portion of the first wiring layer connected to an upper side of the through-via; a second wiring layer disposed on the lower surface of the glass layer, at least a portion of the second wiring layer connected to a lower side of the through-via; and a second insulating material covering at least a portion of an external surface of the glass layer. The first and second insulating materials include substantially the same material.



[[Category:H05K1/03]]
[[Category:H05K1/02]]
[[Category:H05K1/11]]
[[Category:H05K3/46]]
[[Category:CPC_H05K1/0306]]