View source for 18437119. SEMICONDUCTOR MANUFACTURING APPARATUS (Kabushiki Kaisha Toshiba)

=SEMICONDUCTOR MANUFACTURING APPARATUS=


==Organization Name==

[[:Category:Kabushiki Kaisha Toshiba|Kabushiki Kaisha Toshiba]]


[[Category:Kabushiki Kaisha Toshiba]]

==Inventor(s)==

[[:Category:Shun Hasebe of Nonoichi Ishikawa (JP)|Shun Hasebe of Nonoichi Ishikawa (JP)]][[Category:Shun Hasebe of Nonoichi Ishikawa (JP)]]

==SEMICONDUCTOR MANUFACTURING APPARATUS==


This abstract first appeared for US patent application 18437119 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS

==Original Abstract Submitted==

A semiconductor manufacturing apparatus according to the present embodiment includes a stage configured to support a semiconductor wafer. A probe card is positioned above the stage. A first electrode is formed of a conductive material, is movable on the stage from an outer side of the stage toward a center, and is contactable with a side surface of the semiconductor wafer.



[[Category:H01L21/687]]
[[Category:G01R1/073]]
[[Category:CPC_H01L21/68785]]